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Applications may vary by product:
- High-voltage and dielectric testing
- A variety of heat transfer applications
- Cooling and thermal management during the manufacturing processes
- Electronic reliability, hermetic seal/gross leak, and thermal shock testing
- Vapor phase reflow soldering applications, including:
- BGA attach
- Fluxless fusion of circuit board electroplating
- Conventional through-hole or SMT circuit assembly reflow
- Assembly of metal components having complex geometric shapes
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