Highly engineered structured abrasive products deliver reliable performance for critical semiconductor CMP applications. 3M™ Diamond Pad Conditioners use deliberate diamond placement and protusion to produce a consistent finish, with superior diamond retention to reduce scratching.
Key features and benefits:
- Lower cost of ownership
- Optimized for extended pad and disk life
- Flat area of active diamonds for low non-uniformity
- Exclusive polymer substrate enhances corrosion resistance
- Diamonds secured with both chemical and mechanical bonds for superior retention
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