Eliminate defects and achieve the precision finish your operation demands with advanced abrasive products from 3M. Fast and cost-efficient abrasives, our products bring superior consistency to lapping and polishing fiber optics, wafer substrates, memory disks, and other photonic and electronic components.
Abrasives Product Families
These highly engineered fixed abrasive products give you improved planarization without slurries and can help increase the consistency of your semiconductor CMP process.
These advanced lapping films offer a cleaner, more consistent alternative to diamond compounds or slurries. As a replacement for traditional slurries, these films can reduce polishing time, give you a better edge finish and flatness, and eliminate slurry disposal problems.
These high-quality films provide a precision finish every time. Available in discs, rolls and sheets, our lapping films are ideal for polishing fiber optic connectors and rigid memory disks, texturing thin film disks, roll superfinishing and flat lapping applications.
Our advanced polishing films help you consistently meet geometry and fiber height requirements in your MT connector polishing operation. Available in either abrasive or non-abrasive products, our polishing films give you a cleaner, more consistent alternative to diamond compounds or slurries.
Helps reduce finishing times with our innovative microreplicated structured abrasives. As these film-backed abrasives are used, fresh minerals are continuously exposed, ensuring a fast and extremely consistent cut rate through the long life of the abrasive.
Comprised of micron graded particles slurry coated onto a non-woven synthetic backing, the superior flexibility of this product allows for fast and easy finishing and polishing, even on highly contoured surfaces.
