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3M supplies custom 1- and 2-metal layer flexible circuits for fine pitch and/or high-density applications. Using chemical etching to form the dielectric pattern enables isolated and free dielectric features -- as well as complex and fine features -- while avoiding costly punch tooling, laser drilling, and solder resists.
With bench-to-bench engagement, we will apply our advanced engineering services to optimize your application, from initial design through volume production.
- Adhesiveless construction
- Foldable and flexible
- Lower assembly and system costs
- High reliability
- Thin gold or copper traces
- Low moisture sensitivity (LCP)
- Integrated test feature options
- High dimensional stability and chemical resistance
- Low ionics
- Rectangular conductors create flat bonding surfaces
- True edges for fiducials
- Range of thicknesses available for conductive layer
- High volume roll-to-roll processing
- Polyimide or liquid crystal polymer (LCP) dielectric material
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