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Product Catalog for Interconnects > 3M™ Textool ™ Test & Burn-In Sockets > 3M™ Textool™ Ball Grid Array (BGA) Sockets, Open Top > 

3M™ Textool™ Test & Burn-In Ball Grid Array Sockets, 93XX Series 


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3M™ Textool™ Test & Burn-In Ball Grid Array Sockets, 93XX Series
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1.00 mm pitch Sockets, Types 0, I, II, III Open Top

Tech Data Sheet (PDF 536.0K)
Regulatory Compliance Information (PDF 143.0K)

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Features for 3M™ Textool™ Test & Burn-In Ball Grid Array Sockets, 93XX Series:

· Double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress
· Contact tips touch ball above its center plane moving ball deformation away from seating plane
· Designed to allow excellent air flow around device
· Includes a retractable locating guide for easy board mounting even with hundreds of leads
· Compatible with most robotic handlers
· Helps provide easy manual operation
· Accepts package body sizes up to 47.5 mm square with a maximum matrix of 45 x 45
· See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information

· For more information refer to Data Sheet TS9300 (TS-9300)

Document Name
 

Technical Documents

Regulatory Compliance Information (PDF 143.0K)
3M™ Textool™ BGA Test & Burn-In Sockets, TS9300 (PDF 536.0K)
  
 

Marketing & Sales

3M™ Textool™ Test and Burn-in Socket Catalog (I.PDF 1052.0K)
3M™ Textool™ Open Top Brochure (INDD.PDF 1261.0K)
3M Interconnect Products Shortform Catalog (PDF 2286.0K)
  
 

CAD Models (Part Specific)

No CAD Models available for this product.