3M releases material library for use in ANSYS Simulation Software
3M Embedded Capacitance Material now available in HFSS and SIwave
AUSTIN, Texas – April 6, 2010 - Printed circuit board and IC package design engineers can now
download a simulated model of Embedded Capacitance Materials (ECM) from 3M for use in
HFSS™ and SIwave™ engineering simulation software. Part of the Ansoft family of products from
ANSYS, Inc. (NASDAQ: ANSS), HFSS and SIwave technologies enable design engineers to
perform complete signal- and power-integrity analyses from DC to beyond 10 Gbps on printed
circuit boards and IC packages. The availability of 3M ECM in the HFSS and SIwave programs
means that design engineers can better address their noise issues early in the design cycle by
incorporating the material into their design simulations, resulting in improved performance with
fewer design spins.
3M ECM is a thin, high-performance embedded capacitor laminate that helps reduce
impedance, power bus noise, EMI and discrete capacitor count. The material allows design
engineers to differentiate their products through dramatically improved performance and reduced
size because the laminate uses less board "real estate" than surface mounted decoupling capacitors.
3M ECM is compatible with most rigid and flex printed circuit board processing, including laser
drilling. Fabricators and OEMs worldwide may use 3M ECM without purchasing a license from
3M. The material is RoHS Compliant 2005/95/EC*.
"3M's embedded capacitance material library will give HFSS and SIwave simulation
software users a real competitive advantage," said Larry Williams, director of product management
at ANSYS. "State-of-the-art product design must incorporate advanced technology materials and
tools. Providing easy access to these next-generation 3M materials means that designers can
concentrate on improving the signal and power integrity of their products in development rather
than at the prototype stage."
The 3M ECM library can be downloaded for use within ANSYS products at
HFSS technology is the industry-standard software for 3-D full-wave electromagnetic field
simulation for design, simulation, and validation of complex RF, microwave, high-speed channel
and power-delivery systems in modern, high-performance electronics. SIwave software is an
electromagnetic field solver that performs broadband signal- and power-integrity analyses along
with DC voltage and current analysis for complete boards and packages with HFSS technology.
SIwave offers comprehensive electromagnetic interference and compatibility analyses, and it has
the unique ability to couple board and package electromagnetic fields for complete system-level
"Because HFSS is industry-standard simulation software for design engineers, it just made
sense for 3M to participate in the Ansoft tools design library," said Vishal Pahwa, global lead for
Embedded Capacitance Material, 3M Electronic Solutions Division. "3M's Embedded Capacitance
Material gives design engineers an excellent tool to improve electrical performance and ultimately
create better products."
About ANSYS, Inc.
ANSYS, Inc., founded in 1970, develops and globally markets engineering simulation
software and technologies widely used by engineers, designers, researchers and students across a
broad spectrum of industries and academia. The Company focuses on the development of open and
flexible solutions that enable users to analyze designs directly on the desktop, providing a common
platform for fast, efficient and cost-conscious product development, from design concept to final stage
testing and validation. The Company and its global network of channel partners provide sales,
support and training for customers. Headquartered in Canonsburg, Pennsylvania, U.S.A., with more
than 60 strategic sales locations throughout the world, ANSYS, Inc. and its subsidiaries employ
over 1,600 people and distribute ANSYS products through a network of channel partners in over 40
countries. Visit www.ansys.com for more information.
About 3M Electronic Solutions Division
3M Electronics Solutions Division offers innovative solutions to the electronics market,
such as static control products; copper interconnect systems; cables and cable assemblies; carrier
and cover tapes and trays; flexible circuits; embedded capacitor materials; and Textool brand test
and burn-in sockets. For more information on these solutions available from the 3M Electronic
Solutions Division, visit http://www.3Mcapacitance.com.
*RoHS Compliant 2005/95/EC means that the product or part ("Product") does not contain any of
the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as
amended by Commission Decision 2005/618/EC, unless the substance is in an application that is
exempt under EU RoHS. Unless otherwise stated by 3M in writing, this information represents
3M's best knowledge and belief based upon information provided by third party suppliers to 3M.
3M and Textool are trademarks of 3M Company.
Camera Link is a trademark of Automated Imaging Association
ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered
trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries.
All other trademarks listed herein are owned by their respective companies.
Editors: Electronic images available from http://www.3m.com/esdnews or contact Jane Kovacs at email@example.com.
Jane Kovacs, 3M
on twitter @3MJane
For all other inquiries: http://www.3m.com/PressContact