Highly engineered structured abrasive products deliver reliable performance for critical semiconductor CMP applications. 3M™ Fixed Abrasives for CMP deliver improved planarization without slurries. 3M™ Diamond Pad Conditioners use deliberate diamond placement and protrusion to produce a consistent finish, while superior diamond retention reduces wild scratching.
Key features and benefits:
- Lower cost of ownership
- Optimized for extended pad and disk life
- Flat area of active diamonds for low non-uniformity
- Exclusive polymer substrate enhances corrosion resistance
- Diamonds secured with both chemical and mechanical bonds for superior retention
Long-lasting 3M™ Diamond Pad Conditioners properly prepare the surface of the CMP pad. The advanced design of these next-generation conditioners gives you reliable 3M performance. Deliberate diamond placement produces a consistent finish, while superior diamond retention reduces wild scratching.
3M's innovative structured abrasive CMP product offers superior planarization and eliminates traditional slurries and pads in the chemical mechanical planarization of semiconductor wafers.
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