
3M introduces "Next-Generation" adhesive technology, designed to improve your IC assembly process. 3M’s printable die and stiffener attach adhesives (966A, 981B, 809D) enable robust process control and have demonstrated very high reliability.
Formulated as 100% solid, thixotropic pastes, 3M™ UV B-Stage Adhesives are applied to substrates using conventional screen or stencil printing equipment. The adhesive is then B-staged by exposure to ultraviolet (UV) light. After B-staging, the printed adhesive may be stored for up to four weeks prior to completing the bonding cycle with no loss of adhesive performance. Low pressure bonding is sufficient to provide excellent substrate wetting. A thermal cure cycle yields fully cross-linked, void-free bonds. 3M can modify properties such as tack, theology, modulus, and others to meet your specific process requirements.
The "Next-Generation" adhesive technology, designed to improve your assembly process:
- Printable to increase thoroughput via batch application
- 100% solids for long work life on printing equipment and precise bondline control
- UV B-stage technology for better B-stage process control and reduced resin bleed out...and your product's reliability
- JEDEC moisture sensitivity (MSL) 2/260
- Excellent adhesion to a variety of substrates
3M™ UV B-Stage Adhesive for Die Attach
New 3M™ UV B-Stage Adhesive 966A offers an advanced alternative to conventional die bonding adhesives.
3M™ UV B-Stage for Stiffener Attach
New 3M™ UV B-Stage Adhesive 809D and 981B offer an alternative to conventional adhesives employed for stiffener attach and other IC bonding applications.
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