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3M™ Anisotropic Conductive Films

3M™ Anisotropic Conductive Films

Get the job done fast, easy and economically with ACF Interconnect Solutions from 3M. Our reliable, production-proven technologies can replace soldering and mechanical fasteners in many applications, helping to save on space requirements.

  • Products for a variety of applications including flex-to-board, flex-to-flex and flex-to-glass for display
  • Replaces solder, for lead-free solutions
  • Replaces connectors for potential cost savings and low standoff
SpecificationsProduct DocumentationApplication Tips
Product Adhesive Thickness Particle Type Pitch Applications/Notes
3M™ Anistropic Conductive Film Adhesive 7303 74 microns Silver-coated glass 500 microns Offers low bonding temperature for connecting polyester flex-to-PCB or polyimide flex-to-PCB or flex-to-flex. Excellent resistance to low temperatures and solvents.
3M™ Anistropic Conductive Film Adhesive 7313 63 microns Silver-coated glass 500 microns Fast bonding time for connecting polyester flex-to-PCB or polyimide flex-to-PCB or flex-to-flex. Compatible with automated processes. Storage at room temperature.
3M™ Anistropic Conductive Film Adhesive 5460R 40 microns Gold-plated nickel 200 microns For connecting copper on polyimide flex-to-PCB and flex-to-flex
3M™ Anistropic Conductive Film Adhesive 5552R 19 microns Gold-plated nickel With polymer core <100 microns</td/> For connecting copper on polyimide flex-to-glass
3M™ Grounded Heat Sink Bonding Film 7373 50 microns Silver-coated glass   Ideal for grounded bonding of high frequency PCBs, such as cellular base station amplifiers, to heat sink spreaders. It is also used for multilayer lamination and electrical connection between PCB layers.
3M™ Z-Axis Electrically Conductive Tape 9703 50 microns Silver-coated nickel 800 microns Good adhesion; reworkable. For connection/bonding/grounding flex circuits, printed circuits boards, EMI/RFI shields & gaskets; PSA attachments, at room temperature. Not recommended for extreme high/low temperatures.
3M™ Anisotropic Conductive Film Adhesive 5363 40 microns Gold-plated nickel 200 microns For connecting copper on polyimide flex to PCB and flex-to-flex. Excellent high temperature reliability. Fast bond time.
3M™ Z-Axis Adhesive Film 8794 60 microns Silver-coated filler 1000 microns Good adhesion to substrates such as ABS, PVC and Melinex", commonly used to bond and connect micromodules to antennae for Smart Card applications. Also ideal for any applications where fast bond times and reliable connections are required. Stored at room temperature.
3M™ Electrically Conductive Adhesive Transfer Tape 9705 50 microns Silver-coated filler 1000 microns Good adhesion; reworkable. For connection/bonding/grounding flex circuits, printed circuit boards, EMI/RFI shields & gaskets, PSA attachments, at room temperatures. Not recommended for extreme high or low temps. Standard outgassing.