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Using Embedded Capacitance to Improve Electrical Performance, Eliminate Capacitances and Reduce Board Size in High Speed Digital and RF Appllications PDF 899K
by Joel S. Peiffer (3M Company) Presented at the 2007 IPC Printed Circuits Expo, Apex and Designers Summit on Wed., Feb 21, 2007 at the Los Angeles Convention Center, Los Angeles, California.
Embedded Capacitance Material Advantages PDF 13K
Embedded Capacitance Material Product Bulletin PDF 376K
The History of Embedded Distributed Capacitance PDF 288K
by Joel S. Peiffer (3M Company) August 2004. Reprinted with permission of Printed Circuit Design and Manufacture.
Ultra-Thin, Loaded Epoxy Materials for Use as Embedded Capacitance Layers PDF 266K
By Joel Peiffer (3M Company) Previously published by Printed Circuit Design and Manufacture, April 2004. Reprinted with permission.
Power-Bus Decoupling With Embedded Capacitance in Printed Circuit Board Design PDF 891K
By Minjia Xu, Todd H. Hubing, Juan Chen, Thomas P. Van Doren, James L. Drewniak, Richard E. DuBroff. Copyright © 2003 IEEE. Reprinted from IEEE Transactions on Electromagnetic Compatibility, Vol. 45, No. 1, February 2003. *
Electrical Performance Advantages of Ultra-Thin Dielectric Materials Used for Power-Ground Cores in High Speed, Multilayer Printed Circuit Boards PDF 425K
by Joel Peiffer (3M Company), Bob Greenlee (Merix Corporation), and Istvan Novak (Sun Microsystems) Previously presented at IPC Expo 2003. Reprinted with permission.
Frequently Asked Questions for Printed Circuit Board fabricators: Answers from 3M PDF 600K
By Joel S. Peiffer, 3M
NCMS Embedded Decoupling Capacitance Project PDF 950K
By Richard Charbonneau, StorageTek
Frequently Asked Questions for Original Equipment Manufacturers: Answers from SUN Microsystems, Inc. PDF 650K
By Valerie St.Cyr and Istvan Novak, SUN Microsystems, Inc.
Frequently Asked Questions for Original Equipment Manufacturers: Answers from COMPAQ Computer Corp. PDF 15K
By John Grebenkemper, Compaq
Processing Thin Core Capacitance Materials PDF 250K
By Bob Greenlee (Merix Corporation). Previously presented at IPC Expo 2002. Reprinted with permission.
Broadband Characterization of Dielectric Films for Power-Ground Decoupling PDF 374K
By J. Obrzut and R. Nozaki (NIST) IEEE Instrumentation and Measurement Technology Conference (Budapest, Hungary), May 2001. Reprinted with permission.
Fabrication of Embedded Capacitance Printed Circuit Boards PDF 221K
By Joel Peiffer (3M Company) Previously presented at IPC Expo, April 2001. Reprinted with permission.
Embedded Capacitance Material Evaluation PDF 227K
By Joel Peiffer (3M Company) Previously presented at Apex, January 2001. Reprinted with permission.
* This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of 3M's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.
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