Electronics Design and Manufacturing

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Input/Output Connectors, Storage Connectors, Board-to-Board Connectors More »	Optically Clear, Electrically Conductive, Anisotropic Conductive Films More »
Epoxy, Bonding Films, Light Cure More »	Workstations, Packaging, Test Equipment More »
Diamond Lapping, Diamond Discs, for CMP More »	Engineered Fluids, 3M™ Fluorinert™ Liquids, Performance Fluids More »
Flex Circuits, Embedded Capacitor Material More »	Cover Tapes, Embossed Carrier, Moisture Barrier Bags More »

Interconnect, Embedded Capacitor Materials, Static Control More »	Test & Burn-In, Testing Fluids, Tape & Reel More »
CMP, Surfactants, Cleaning More »	Interconnect, Static Control, Test & Measurement More »
Thermal Management, EMI/RFI, Attaching & Bonding More »	EMI/RFI, Thermal Management, Attaching & Bonding More »
Attaching & Bonding, EMI/RFI, Thermal Management More »	Final Assembly, Media Fabrication, Vibration Damping More »
Electrolytes, Cathodes, Plastic Adhesive More »	Flex, EMI/RFI, Interconnects More »
Networking, Thermal Management, Test & Burn-in More »	EMI/RFI, Bonding & Sealing, Touch Interfacing More »
Interconnect, Thermal Management, Fiber Optic Polishing More »	EMI/RFI, Interconnect, Tapes & Adhesives More »
EMI/RFI, Thermal Interface Materials, Engineered Fluids More »

3M™ MetPak™ High Speed Hard Metric B19 Connector, HSHM Series

System design engineers working with VME and CompactPCI backplane systems now have a cost-effective path to 5 Gbps without disruptive backplane redesign or a forklift upgrade using the new 3M MetPak HSHM Press-Fit B19 Connector. Learn more »