3M™ MetPak™ 2-FB Inverse Header, MP2 Series 

· Three levels of early mate, late break (EMLB) sequencing or selective loading options
· Footprint compatible with standard Futurebus+®
· Solder tail with true-position wafer
· Ideal for hot swapping applications
· End-to-end stackable
· Right angle male for daughter card
· Mates with MP2-R for backplane applications and MP2-SXXXG for coplanar applications
· See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information

· For more information, refer to Data Sheet TS1122 (TS-1122)