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3M Showcases High-Performance Connectivity Solutions at DesignCon 2013

SANTA CLARA, CALIF. – Jan 29, 2013 - The 3M Electronic Solutions Division will exhibit some of its industry-leading products for high-performance computing and networking applications at booth #414 at the DesignCon 2013 Expo. The event takes place Jan. 29-30 at the Santa Clara Convention Center.

3M™ Twin Axial Cable and Cable Assemblies
3M will showcase a mechanical backplane demonstration chassis featuring its Twin Axial Cable SL8800 Series and the new ExaMax™ IO Connector from FCI.

The Twin Axial Cable from 3M is ideal for space-constrained, high-performance systems and networks. The thin, ribbon-style cable can be bent and folded with minimal loss or performance impact, opening up new routing possibilities. Inside the box, the low-profile cable can be routed to allow more room for components and to help improve air flow, potentially reducing costs. In data center settings, the highly routable cable can conserve precious space in the rack. The cable can be converted to individual pairs for applications that do not require the ribbon format.

The revolutionary ExaMAX™ IO Connector design combines a new connector terminal design technology that significantly decreases terminal stub and ground-mode resonances with an optimized cable termination that minimizes impedance mis-match and signal loss.

Twin Axial Cables Assemblies for the following applications are also on display at the 3M booth:

  1. Internal and External MiniSAS
  2. MiniSAS Fan-out
  3. SATA
  4. HD MiniSAS
  5. PCI Express
  6. SFP+
  7. QSFP+ QDR and FDR

3M™ Active Optical Cable (AOC) Assemblies
3M offers a full line of low-power, highly reliable Active Optical products. AOC assemblies for the following applications are on display at the 3M booth:

  1. QSFP+ QDR and FDR
  2. QSFP+ Fan-Out
  3. CX4 and CX4-QSFP Hybrid
  4. CXP
  5. SFP+

3M™ Embedded Capacitance Material
3M has fully launched its Embedded Capacitance Material (ECM) C2006 at DesignCon 2013. The ultra-thin, high capacitance density (20 nF per square inch) laminate material is now available for high-volume manufacturing.

ECM from 3M helps facilitate product innovation and lower system costs. The 3M material reduces impedance, power bus noise and electromagnetic interference (EMI), and simplifies printed circuit board (PCB) layout by decreasing discrete capacitor count. It is designed to be used in MEMS microphones and sensors, telecom, computer, test and measurement, military/aerospace, medical and consumer electronics applications. See news release.

3M™ Thermal Management Materials for Electronics
This broad range of products from 3M offers efficient thermal transfer for a wide range of applications requiring thermal management. Each tape combines 3M high performance acrylic adhesive with highly conductive ceramic particles for a reliable, user-friendly thermal interface. Learn more.
3M recently announced a faster, easier way to order 3M cables assemblies. allows customers to buy cables directly from 3M, no matter how small the order. See news release.

3About 3M Electronic Solution Division – Interconnect
3M Electronic Solutions Division’s Interconnect business offers a variety of innovative connectors, cables and cable assemblies, embedded capacitance materials and Textool brand test and burn-in sockets for component engineers and designers in the electronics industry. For more information about 3M’s Interconnect solutions, visit: Information about 3M Company is available online.

3M and Textool are trademarks of 3M Company.
All other trademarks listed herein are owned by their respective companies.

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3M:Laurel Chesky

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