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| Flexible Electronic Substrates: 3M Launches New Static-dissipative Cover Tape for Electronic Components Market
| Interconnect Solutions: 3M Launches Active Optical Cable for SFP+ Applications
| Electronics Markets Materials: No. 16 3M Ford Fusion Features Sustainable Fire Suppression Fluid
| Static Control Solutions: 3M to Demonstrate Its Comprehensive Static Management Program at IPC APEX 2013
| Interconnect Solutions: 3M Launches High-Performance Embedded Capacitance Material at DesignCon 2013
| Interconnect Solutions: 3M Showcases High-Performance Connectivity Solutions at DesignCon 2013
| Interconnect Solutions: Buying 3M Cable Assemblies Is Now Faster and Easier with 3McablesDirect.com
| Interconnect Solutions: FCI and 3M Announce Second-source Agreement for HPCE® and HP2™ Power Products
| Electronics Markets Materials: Data Centers Rely on the Performance and Sustainability of 3M™ Novec™ 1230 Fire Protection Fluid
| Interconnect Solutions: New 3M Cable Assembly for PCI Express Extender Cards Enables Higher Density Designs
| Interconnect Solutions: New Industrial RJ45 Modular Plug from 3M Combines Robust Design with Quick and Easy Field Assembly
| Interconnect Solutions: Avnet Electronics Marketing Americas Awarded Distribution 2011 Top Performance Award from 3M
| Electronics Markets Materials: 3M and Nordson Form Joint Agreement to Serve Consumer Electronics Manufacturers
| Electronics Markets Materials: This Earth Day, 3M Makes Electronics Recycling Easier
| Embedded Capacitance Material: 3M Adds Embedded Capacitance Material Production Capability in China to Better Serve Customers in Asia
| Interconnect Solutions: e-Components to Represent 3M Interconnect Solutions in Southeast U.S
| Static Control Solutions: 3M Announces Comprehensive End-to-End Static Management Program
| Interconnect Solutions: 3M Showcases its Growing Portfolio of 3M Twin Axial Cable Assembly Solutions at DesignCon 2012
| Interconnect Solutions: New Active Optical Cable Assemblies from 3M for CX4 and QSFP+ Applications Launch at DesignCon 2012
| Interconnect Solutions: FCI Unveils its Newest HD SAS Internal Cable Assemblies, featuring 3M Twin Axial Cable SL8800 Series, at DesignCon 2012
| Interconnect Solutions: 3M Launches High Density Versions of its Embedded Capacitance Material at DesignCon 2012
| Interconnect Solutions: 3M™ High Speed with Ethernet Cable for HDMI®
| Electronics Markets Materials: 3M Expands Manufacturing of Pad Conditioners in Singapore and Opens Factory in Taiwan
| Electronics Markets Materials: 3M Expands U.S. Development Laboratory for Semiconductor CMP Products
| Electronics Markets Materials: 3M Adds Temporary Wafer Bonding Application Lab in Taiwan
| Interconnect Solutions: 3M's Revolutionary Cable Solution Recipient of 2011 R&D 100 Award
| Electonics Markets Materials: 3M™ Novec™ 1230 Fire Protection Fluid Protects the Alamo at The Daughters of The Republic of Texas Library
| Interconnect Solutions: 3M Supports New Camera Link HS Standard at Automate 2011
| Interconnect Solutions: 3M Adds Mini Serial Attached SCSI (miniSAS) Cable Assemblies to its Leading-Edge Twin Axial Cable Platform
| Interconnect Solutions: 3M Announces Comprehensive Range of New 2 mm Pitch IDC Cable-to-Board Interconnect Solutions
| Interconnect Solutions: 3M Now Offers Full Embedded Connector Portfolio to Address Customer Demand
| Interconnect Solutions: 3M Introduces Next Generation of Ultra Hard Metric (UHM) Cable Assemblies
| Interconnect Solutions: 3M Unveils High-Routability, High-Speed Twin Axial Ribbon Cable SL8800 Series
| Interconnect Solutions: 3M Announces Availability of Connector Headers for CFast™, the new Compact Flash® Association (CFA) Standard
| Interconnect Solutions: New Power Clamp Connectors and Cables Solutions from 3M Provide Reliable, Cost-effective Connectivity for Industrial Control Systems
| Interconnect Solutions: 3M Joins CC-Link Partner Association Board of Directors to Accelerate Wire-saving Connector Development
| Electonics Markets Materials: 3M Announces Family of Transparent Conductors
| Electonics Markets Materials: 3M Innovation Enables Touch in Handheld Devices Without Being Seen
| Electonics Markets Materials: 3M Introduces Breadth of Electrically Conductive Cushioning Gasket Tapes
| Interconnect Solutions: 3M Retainer Clip for CompactFlash Provides Reliable Retention of Memory Cards
| Interconnect Solutions: 3M Interconnect Catalog Now Available on Distributor Web Sites
| Embedded Capacitance Material: 3M Electronic Solutions Division Introduces Halogen-Free Embedded Capacitance Material
| Embedded Capacitance Material: 3M releases material library for use in ANSYS Simulation Software
| Static Control: 3M Showcases Products and Solutions for the Electronics Market at APEX in Las Vegas
| Electronics Markets Materials: 3M and Yushin Precision Equipment Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors
| Interconnect Solutions: New PICMG 2.30 Standard Names 3M Ultra Hard Metric (UHM) Socket Connector as the high-speed J2 Connector
| Transport: 3M Releases Polycarbonate Ultra Precision Carrier Tape for Electronics Transport
| Interconnect Solutions: 3M Offers Wide Range of Power over Camera Link Cabling Solutions for Machine Vision Applications
| Embedded Capacitance Material: New 19-micron Embedded Capacitance Material from 3M Offers Cost-effective Option to Reduce Size and Increase Speeds in Printed Circuit Boards
| Electronics Markets Materials: 3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors
| Static Control: New 3M EM Eye Meter Series Offers Versatile Solution for EMI, RF and ESD Detection
| Static Control: 3M Introduces Wrist Strap and Ground Monitor 773 for Electronics Assembly
| Interconnect Solutions: Recently Introduced Ultra Hard Metric (UHM) Press-Fit Socket Connector from 3M Selected for Draft PICMG 2.30 Standard
| Interconnect Solutions: 3M Introduces IEEE 1394-Compliant I/O Connectors
| Interconnect Solutions: 3M Unveils New High-Performance, Lowest-Crosstalk 2 mm Hard-Metric Socket Connector
| Interconnect Solutions: New Development Kit from 3M Helps Design Engineers Achieve Multi-Gigahertz Performance in 2 mm Footprint

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