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Meet the 3M Flex Experts

This 3M core team has more than 130 years in material science and 85 years of combined experience of key personal experience in the flexible circuit industry. Let 3M be the team to provide you with the expertise you need for a specialized, customer-centric approach to assist you in developing flex applications and solutions.

Nate Kreutter Robin Gorrell Michael Graff Ronald Imken Howard Kaplan Dennis Tan Siang Sin Foo
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Nate Kreutter

Application Engineer
Austin, Texas
Phone: 1(888)-845-3393


Nate has been with 3M since 1984 and is based in Austin, Texas. Nate's primary focus for the past 25 years is in flexible circuits, with more than 28 years of experience in process and application engineering. His area of expertise is the designing, building, and problem-solving of complex designs for various applications, with an emphasis in medical imaging, electronic packaging using flexible circuits, and electroplating. Nate received a bachelor of science in physics from Park University.

Robin Gorrell

Robin Gorrell

Technical Manager
Austin, Texas
Phone: 1(888)-845-3393


Robin joined 3M in 2000 and is based in Austin, Texas. Robin has more than 20 years of experience in the electronics industry, ranging from developing hardware for supercomputers to integrated circuit packaging to flexible circuits. Robin understands all aspects of flex circuit design, development and manufacturing. Robin received a bachelor of science in chemical engineering from the University of Illinois at Urbana/Champaign.

Michael Graff

Michael Graff

Technical Manager
Austin, Texas
Phone: 1(888)-845-3393


Mike joined 3M in 1991, and is based in Austin, Texas. With more than 15 years experience in flex circuit manufacturing, his other specialties include: photolithography, plating, etching, direct metallization, adhesives, soldermasks, coverlays, formulation, compounding and extrusion for low voltage insulation products. Michael received Masters and a PH.D. in polymer science and engineering from the University of Massachusetts at Amherst and a bachelor of science in materials science and engineering from the University of Utah.

Ronald Imken

Ronald Imken

Product Development Specialist
Austin, Texas
Phone: 1(888)-845-3393


Ron joined 3M in 2000 and is currently based in Austin, Texas. Ron has more than more than 36 years of experience in the electronics industry as both a development engineer and as a manufacturing engineer. In his career with 3M, he has focused on process, product and scale-up responsibilities for flexible circuit protective coatings. Other areas of expertise include photoimageable dielectrics and material selection, and testing and development of polymer applications. Ron received a master's of science in chemical engineering from the University of Texas.

Howard Kaplan

Howard Kaplan

Technical Manager
Canoga Park, Calif.
Phone: 1(888)-845-3393


With more than 25 years of experience in the medical flex industry, Howard joined 3M in 2006 and is based in Canoga Park, Calif. Howard has a detailed knowledge of applications, materials, and the processes related to the industry, including the development of application-specific flex circuits and components for medical imaging and sensors. He also has a substantial background in the use of flex circuits in medical, industrial ultrasounds and digital X-ray imaging. Howard received a bachelors of science in Chemical Engineering from Arizona State University.

Dennis Tan

Dennis Tan

Senior Technical Manager for the Electronic Solutions Division,
Asia Pacific Flexible Circuits Business Singapore
Phone: 1(888)-845-3393


Dennis joined 3M in 2000, with global experience in both North America and Asian markets and is currently based in Singapore. With more than 10 years in the electronics industry, he is currently focused on New Product Introduction (NPI) development for customers, advanced integrated circuit packaging design and finite element analysis. Dennis brings to the team an in-depth knowledge of integrated circuit assembly and packaging for next-generation flexible electronic circuitry solutions, from cutting-edge to customized applications. Dennis received a bachelor of engineering (honors) in mechanical engineering from the Queensland University of Technology in Australia, and has been serving as guest lecturer for the National University of Singapore MBA classes since 2007.

Siang Sin Foo

Foo Siang Sin

Senior Principal Applications Engineer, Electronic Solutions Division,Asia Pacific Flexible Circuits Business Singapore
Phone: 1(888)-845-3393


Siang Sin joined 3M in 1999. Based in 3M Singapore, Siang Sin has more than 20 years of experience in state-of-the-art scientific integrated circuit assembly/packaging, testing and reliability covering both rigid to non-rigid flexible electronics. With 3M since 1999, Sin provides design and application solutions for the Asia Pacific region.

Siang Sin's area of expertise includes circuit design, Design for Manufacturability (DFM), and problem-solving for compliance with various industry integrated circuit packaging standards. He has a strong emphasis in electronic packaging using flexible circuits for both standard and non-standard customized applications and performance. Siang Sin received a bachelor of science in mechanical engineering from Nanyang Technological University in Singapore and an MBA from the University of Leicester.