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Product Catalog for Interconnects > 3M™ Textool ™ Test & Burn-In Sockets > 3M™ Textool™ SOIC Sockets > 

3M™ Test & Burn-In SOIC Sockets 

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3M™ Test & Burn-In SOIC Sockets
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Compact envelope w/ tweezer slot for easy loading

Tech Data Sheet (PDF 387.0K)
Regulatory Compliance Information (PDF 143.0K)

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Features for 3M™ Test & Burn-In SOIC Sockets :

· Lid can be actuated from top or front and is compatible with automated load/unload equipment
· Compact envelope and side to side stackability maximize board density
· Tweezer slot for easy manual loading/unloading
· Lid applies 80 grams normal force per lead for maximum electrical reliability
· Accepts Gull Wing JEDEC device sizes in .150" (3.81 mm) and .300" (7.62 mm) body widths

· For more Information refer to Data Sheet TS0338 (TS-0338)

Document Name

Technical Documents

Regulatory Compliance Information (PDF 143.0K)
3M™ Textool™ SOIC Test and Burn-In Socket, TS0338 (PDF 387.0K)

Marketing & Sales

3M™ Textool™ Test and Burn-in Socket Catalog (I.PDF 1052.0K)
3M™ Textool™ Open Top Brochure (INDD.PDF 1261.0K)
3M Interconnect Products Shortform Catalog (PDF 2286.0K)

CAD Models (Part Specific)

No CAD Models available for this product.