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3M™ Textool™ Test & Burn-In Ball Grid Array Lidded Sockets, 91XX Series 


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3M™ Textool™ Test & Burn-In Ball Grid Array Lidded Sockets, 91XX Series
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1.00 mm pitch Sockets, Type I, II, III

Tech Data Sheet (PDF 1944.0K)
Regulatory Compliance Information (PDF 143.0K)

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Features for 3M™ Textool™ Test & Burn-In Ball Grid Array Lidded Sockets, 91XX Series:

· Highly reliable contact that allows for normal variation in BGA ball-diameter and position.
· Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm range in package thickness tolerance
· In BGA applications, direction of contact force is at 45 deg angles away from ball-seat. Results: No ball-deformation at seating plane.
· Eliminates the problem of "hinge-pinch" while applying zero closing force.

· For more information, refer to Data Sheet TS-9100 (TS-9100)

Document Name
 

Technical Documents

Regulatory Compliance Information (PDF 143.0K)
3M™ Textool™ 1.0 mm BGA Test & Burn-In Sockets, TS9100 (PDF 1944.0K)
  
 

Marketing & Sales

3M™ Textool™ Test and Burn-in Socket Catalog (I.PDF 1052.0K)
3M Interconnect Products Shortform Catalog (PDF 2286.0K)
  
 

CAD Models (Part Specific)

No CAD Models available for this product.