Features for 3M™ Molded DIP, 877 Series:
· Part of a complete cable assembly
· Mates with industry standard IC sockets / .100 × .300 inch up to 20 contacts and .100 × .600 inch between 24 and 40 contacts
· One piece, molded-on construction with integral strain relief
· Low profile allows close stacking between components and boards
· Molded-on solder stand-offs facilitate flux removal
· Gold or matte tin plating options
· Closed-end construction
· See Regulatory Information Appendix (RIA) on TS-2149 for chemical compliance information
· For more information refer to Data Sheet TS2152 (TS-2152)
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