Features for 3M™ Test & Burn-In SOIC Sockets:
· Lid can be actuated from top or front and is compatible with automated load/unload equipment
· Compact envelope and side to side stackability maximize board density
· Tweezer slot for easy manual loading/unloading
· Lid applies 80 grams normal force per lead for maximum electrical reliability
· Accepts Gull Wing JEDEC device sizes in .150" (3.81 mm) and .300" (7.62 mm) body widths
· For more Information refer to Data Sheet TS0338 (TS-0338)
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