3M Launches High Density Versions of its Embedded Capacitance Material at DesignCon 2012
Initial availability of ECM from 3M will be one of the highest capacitance density, halogen-free products on the market
SANTA CLARA, Calif., DesignCon 2012 - Jan. 31, 2012 –3M today announced the initial availability of its high-capacitance Embedded Capacitance Material (ECM) at DesignCon 2012, which allows design engineers a new way to greatly improve power integrity and reduce electromagnetic interference (EMI). The newest offering of 3M’s ECM material will provide one of the highest capacitance density and halogen-free* solutions on the market. This helps design engineers provide hi-fidelity signals, high-signal-to-noise ratio in radio frequencies and higher speed digital signals in a variety of high-performance applications such as small form factor computer hardware, high-performance RF boards, microphones, integrated circuit (IC) packaging, and consumer electronics.
Unlike previous 3M ECM versions, which have a maximum capacitance density of approximately 10 nF per square inch, and some existing commercial competitor offerings, which have a maximum capacitance density of approximately 6 nF per square inch, the 3M ECM High- Capacitance Density solutions offer a capacitance density range from 20 up to 40 nF per square inch, making it the one of the highest capacitance density, halogen-free ECM solutions on the market. With the increase in capacitance density, design engineers can now use the offerings to drive high-frequency noise reduction to levels that could not be achieved with current generation solutions.
“As electronic devices continue to see drastic miniaturization, while requiring increased fidelity, 3M is constantly looking for innovative solutions to help drive this market trend,” said Abhay Joshi, global business development manager, 3M Electronic Solutions Division, Interconnect Business. “Our newest line of Embedded Capacitance Material provides the industry with one of the highest amounts of capacitance per square inch, giving design engineers an additional tool in their arsenal to achieve their design goals.”
3M’s line of ECM material offerings can be embedded into printed circuit boards (PCBs) and integrated circuit chip packages where the applications include decoupling and low-pass filtering. With a high-capacitance density offering, the functionality of ECM material can now be ideally leveraged for microphone makers in the miniaturization of their products, along with a significant reduction of RFI on the devices. Fabricators and OEMs worldwide may use 3M’s ECM material without purchasing a license from 3M. The material is RoHS compliant**.
Samples of 3M’s existing line of ECM materials will be available at the 3M booth (#706) at DesignCon 2012 in the Santa Clara Convention Center, Jan. 31 – Feb 1, 2012. To learn more about ECM solutions from 3M and its line of interconnect offerings, visit www.3M.com/ecm
About 3M Electronic Solution Division – Interconnect
3M Electronic Solutions Division’s Interconnect business offers a variety of innovative connectors, cables and cable assemblies, embedded capacitance materials and Textool brand test and burn-in sockets for component engineers and designers in the electronics industry. For more information about 3M’s Interconnect solutions, visit: www.3Mconnectors.com Information about 3M Company is available online.
3M is a trademark of 3M Company.
*Halogen-free is defined as both (1) no halogen compounds are intentionally added to the product or used in the manufacturing process for the product, and (2) any impurities present are less than 900 ppm bromine, less than 900 ppm chlorine, and/or less than 1500 ppm total bromine and chlorine.
**RoHS compliant means that the product or part does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/EC, unless the substance is in an application that is exempt under EU RoHS. This information represents 3M's knowledge and belief, which may be based in whole or in part on information provided by third party suppliers to 3M.
Jenni Balthrop, 3M