3M APAS films are easy to use and can be quickly bonded to a substrate by using a bonding press, roll laminator or a combination of both processes. The product is extremely clean, yielding low outgassing and low ionic contamination, and it is highly moisture resistant (very low moisture absorption). These films also have a long shelf life of seven months at room temperature.
APAS 1592 is a semi-transparent, thermosetting film adhesive designed for adhering stiffeners to heat spreaders and also stiffeners to organic substrates such as polyimide flexible circuit tape (TAB) and BT resin. It is suited for use in the assembly of T-BGA (heat spreader to stiffener), enhanced P-BGA (BT resin to heat spreader) and flip chip (BT resin to heat spreader) packages.
APAS 1592 is a semi-transparent, thermosetting film adhesive designed for adhering stiffeners to heat spreaders and also stiffeners to organic substrates such as polyimide flexible circuit tape (TAB) and BT resin. It is suited for use in the assembly of T-BGA (heat spreader to stiffener), enhanced P-BGA (BT resin to heat spreader) and flip chip (BT resin to heat spreader) packages.
