Design Guides, Materials & Services
With the goal of giving greater freedom to enable your FPC design concepts, 3M Flexible Circuit Foundry business invests in enhancing manufacturing capabilities and developing new material sets. With 3M as your manufacturing partner, you gain access to one of the largest R&D organizations in the world. We'll help you create peace of mind by delivering consistent quality and a stable supply of flexible printed circuits. Put your trust in 3M, a leader in the flexible circuits market.
Click here for the most up to date capacity table (PDF 202 Kb).
| Description | Standard | Advanced |
|---|---|---|
** - Depends on the design constraints, please contact 3M for more information. |
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Imaging(microns)1 and 2 metal layer |
||
| 5µm Cu min. (trace/space) | 30µ/40µ | 20µ/30µ* |
| 12µm Cu min. (trace/space) | 40µ/50µ | 25µ/35µ* |
| 18µm Cu min. (trace/space) | 70µ/50µ | 30µ/45µ* |
| 35µm Cu min. (trace/space) | 125µ/125µ | 70µ/50µ* |
| Min. Via Diameter | 60µ | 25µ* |
| Min. Pad Diameter | 180µ | 75µ* |
| Layer-to-Layer Registration | <75µ | <30µ* |
| Smallest feature | 20µ | 15µ* |
| Dryfilm Coverlay | 25µ, 37µ, 50µ, 62µ | 25µ, 37µ, 50µ, 62µ* |
| Cantilever/Flying Lead Width | 50µ | 37µ* |
Multilayer |
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| Number of Metal Layers | 1-3 layers | up to 6 layers* |
| Metal Layer-to-Layer Tolerance | <75µ | <50µ |
| Via type | Through | Through, buried |
Singulation |
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| Precison Punch | ||
| Positional Tolerance | 25µ | 15µ |
| Feature | 25µ | 15µ |
| - Feature Size | 100µ | 50µ |
| Positional Tolerance | 37µ | 25µ |
Microvias |
||
| Size | 32µ | 25µ* |
| Position Accuracy | 35µ | 25µ* |
| Layers | 1-3 Layers | up to 6 Layers* |
Materials |
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| Plated Copper | 2µ - 70µ | 2µ - 70µ |
| Polyimide | 12µ - 125µ | 12µ - 150µ |
| Adhesives | Mod. acrylic, PSA, mod. Polyimide | Mod. acrylic, PSA, mod. Polyimide |
| Coverlay Film | 12µ PI/12µ ADH. to 75µ PI/75µ ADH. | Additional Photoimagible |
| Photocoverlay | 25µ, 37µ, 50µ, 62µ | 25µ, 37µ, 50µ, 62µ |
| Stiffeners | G10/FR4, Polyimide, BT | G10/FR4, Polyimide, BT |
| EMI Shields | Contact 3M for further information | Contact 3M for further information |
| Heat Transfer Solutions | Contact 3M for further information | Contact 3M for further information |
Dielecteric Patterning |
||
| CO2 Laser and Plasma Etching | Yes | Yes |
| Chemical | Yes | Yes |
Sputtering |
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| Materials | Polyimide | Polyimide |
| Metals | Various metals and metal oxides | Various metals and metal oxides |
Plating |
||
| Electroless Copper | >32µ Via | >20µ Via |
| Electrolytic Nickel | To Desired Thickness | To Desired Thickness |
| Electrolytic Copper | To Desired Thickness | To Desired Thickness |
| Electrolytic Tin/Lead | To Desired Thickness | To Desired Thickness |
| Electrolytic Soft Gold | To Desired Thickness | To Desired Thickness |
| Immersion Gold | .06µ | .06µ |
| Immersion Tin | Yes | Yes |
| OSP | Yes | Yes |
| ENIG | Yes | Yes |
| ENEG | Yes | No |
| Selective Plating | No | Yes |
Panel Size |
||
| Panel Size | 304mm x 457mm | 304mm x 457mm |
Assembly |
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| HASL | Yes | Yes |
| No Lead (RoHS) HASL | Yes | Yes |
| Connectors | Yes | Yes |
| Thermistors | Yes | Yes |
| Passive Components | Yes | Yes |
| Surface Encapsulation/Potting | Yes | Yes |
| RoHS* - Components Available | Yes | Yes |
| Stiffener/Reinforcement/Adhesive | Yes | Yes |
Quality |
||
| Visual Inspection | Yes | Yes |
| Auto Optical Inspection | Yes | Yes |
| Scanning Electron Microscope | Yes | Yes |
| Electrical Test | Yes | Yes |
| Cross-Section | Yes | Yes |
| X-ray Fluoresence | Yes | Yes |
| Optical Measurement System | Yes | Yes |
| Profilometer | Yes | Yes |
| Impedence Matching | Yes | Yes |
| Ionic Contamination | Yes | Yes |
*"RoHS Compliant 2002/95/EC" means that the product or part ("Product") does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/EC, unless the substance is in an application that is exempt under EU RoHS. This information represents 3M's knowledge and belief, which may be based in whole or in part on information provided by third party suppliers to 3M.
In the event any product is proven not to conform with 3M's Regulatory Information Appendix, then 3M's entire liability and Buyer's exclusive remedy will be in accordance with the Warranty stated below.
Click here for the most up to date capacity table (PDF 201 Kb).
| Description | Standard | Advanced |
|---|---|---|
** - Depends on the design constraints, please contact 3M for more information. |
||
Imaging(microns) |
||
1-Metal Layer |
||
| 8µm Cu min. (trace/space) | 17.5µ/17.5µ | 15µ/15µ* |
| 12µm Cu min. (trace/space) | 17.5µ/17.5µ | 17.5µ/17.5µ* |
| 18µm Cu min. (trace/space) | 25µ/25µ | 25µ/25µ* |
| 35µm Cu min. (trace/space) | 50µ/50µ | 50µ/50µ* |
2-Metal Layer |
||
| 5µm Cu min. (trace/space) | 60µ/60µ | 30µ/30µ* |
| 12µm Cu min. (trace/space) | 60µ/60µ | 30µ/30µ* |
| 18µm Cu min. (trace/space) | 75µ/75µ | 60µ/60µ* |
| 35µm Cu min. (trace/space) | 75µ/75µ | 60µ/60µ* |
| Min. Via Diameter | 35µ | 150µ* |
| Min. Pad Diameter | 240µ | +100um* |
| Layer-to-Layer Registration | 120µ | 75µ* |
| Smallest feature | 60µ | 30µ* |
| Dryfilm Coverlay | 25µ,38µ | 25µ,38µ* |
| Cantilever/Flying Lead Width | 75µ* | 75µ* |
Singulation |
||
| Registration | +/- 100µ | +/- 100µ |
| Precison Punch | Contact 3M | Contact 3M |
| Positional Tolerance | Contact 3M | Contact 3M |
| Feature | Contact 3M | Contact 3M |
| Positional Tolerance | Contact 3M | Contact 3M |
Microvias |
||
| Size | 35µ | 35µ |
| Position Accuracy | +/-100µ | +/-100µ |
| Layers | 2 | 2 |
Materials |
||
| Plated Copper | 5µ - 35µ | 3µ - 35µ |
| Polyimide | 25µ - 50µ | <25µ -50µ |
| Adhesives | Acrylic, PSA | Acrylic, PSA |
| Coverlay Film | 12µ/25µ to 50µ/50µ | 12µ/25µ to 50µ/50µ |
| Soldermask | 3µ - 30µ | 3µ - 30µ |
| Photocoverlay | 25µ, 38µ | 25µ, 38µ |
| Stiffeners | FR4, Polymide, BT | FR4, Polymide, BT, Al |
| EMI Shields | Contact 3M | Contact 3M |
| Heat Transfer Solutions | Contact 3M | Contact 3M |
Dielecteric Patterning |
||
| CO2 Laser and Plasma Etching | Contact 3M | Contact 3M |
| Chemical | Yes | Yes |
Sputtering |
||
| Materials | Polyimide | Polyimide |
| Metals | Various metals and metal oxides | Various metals and metal oxides |
Plating |
||
| Electroless Copper | Contact 3M | Contact 3M |
| Electrolytic Nickel | 0.5µ - 2.8µ | 0.5µ - 2.8µ |
| Electrolytic Copper | 3µ - 35µ | 3µ - 35µ |
| Electrolytic Tin/Lead | Contact 3M | Contact 3M |
| Electrolytic Soft Gold | 0.1µ - 0.3µ | 0.1µ - 0.3µ |
| Immersion Gold | Contact 3M | Contact 3M |
| Immersion Tin | Contact 3M | Contact 3M |
| OSP | Contact 3M | Contact 3M |
| Selective Plating | Yes(Ni & Au) | Yes(Ni & Au) |
Roll-to-Roll-Processing |
||
| Roll-to-Roll | Yes | Yes |
| Web width | 304mm | 304mm |
Assembly |
||
| HASL | Yes | Yes |
| No Lead (RoHS) HASL | Yes | Yes |
| Connectors | Yes | Yes |
| Thermistors | Yes | Yes |
| Passive Components | Yes | Yes |
| Surface Encapsulation/Potting | Yes | Yes |
| RoHS* - Components Available | Yes | Yes |
| Stiffener/Reinforcement/Adhesive | Yes | Yes |
Quality |
||
| Visual Inspection | Yes | Yes |
| Auto Optical Inspection | Yes | Yes |
| Scanning Electron Microscope | Yes | Yes |
| Electrical Test | Yes | Yes |
| Cross-Section | Yes | Yes |
| X-ray Fluoresence | Yes | Yes |
| Optical Measurement System | Yes | Yes |
| Profilometer | Yes | Yes |
| Impedence Matching | Yes | Yes |
| Ionic Contamination | Yes | Yes |
*"RoHS Compliant 2002/95/EC" means that the product or part ("Product") does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/EC, unless the substance is in an application that is exempt under EU RoHS. This information represents 3M's knowledge and belief, which may be based in whole or in part on information provided by third party suppliers to 3M.
In the event any product is proven not to conform with 3M's Regulatory Information Appendix, then 3M's entire liability and Buyer's exclusive remedy will be in accordance with the Warranty stated below.
- Design Services
- 3M offers design services; we can help take a product from concept to development to final mass production of flexible printed circuits.
- Assembly
- Stiffeners
- Cover-lays
- EMI and Chemical Shields
- SMS Assembly
- Substrates
- Adhesiveless polyimides
- High Quality
- Ultra-clean metalized substrates, manufactured by 3M Flexible Circuit Foundry or purchased from a selection of outside suppliers.
