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Design Guides, Materials & Services

With the goal of giving greater freedom to enable your FPC design concepts, 3M Flexible Circuit Foundry business invests in enhancing manufacturing capabilities and developing new material sets. With 3M as your manufacturing partner, you gain access to one of the largest R&D organizations in the world. We'll help you create peace of mind by delivering consistent quality and a stable supply of flexible printed circuits. Put your trust in 3M, a leader in the flexible circuits market.

Click here for the most up to date capacity table (PDF 202 Kb).

Description Standard Advanced

** - Depends on the design constraints, please contact 3M for more information.

Imaging(microns)

1 and 2 metal layer

5µm Cu min. (trace/space) 30µ/40µ 20µ/30µ*
12µm Cu min. (trace/space) 40µ/50µ 25µ/35µ*
18µm Cu min. (trace/space) 70µ/50µ 30µ/45µ*
35µm Cu min. (trace/space) 125µ/125µ 70µ/50µ*
Min. Via Diameter 60µ 25µ*
Min. Pad Diameter 180µ 75µ*
Layer-to-Layer Registration <75µ <30µ*
Smallest feature 20µ 15µ*
Dryfilm Coverlay 25µ, 37µ, 50µ, 62µ 25µ, 37µ, 50µ, 62µ*
Cantilever/Flying Lead Width 50µ 37µ*

Multilayer

Number of Metal Layers 1-3 layers up to 6 layers*
Metal Layer-to-Layer Tolerance <75µ <50µ
Via type Through Through, buried

Singulation

Precison Punch
Positional Tolerance 25µ 15µ
Feature 25µ 15µ
- Feature Size 100µ 50µ
Positional Tolerance 37µ 25µ

Microvias

Size 32µ 25µ*
Position Accuracy 35µ 25µ*
Layers 1-3 Layers up to 6 Layers*

Materials

Plated Copper 2µ - 70µ 2µ - 70µ
Polyimide 12µ - 125µ 12µ - 150µ
Adhesives Mod. acrylic, PSA, mod. Polyimide Mod. acrylic, PSA, mod. Polyimide
Coverlay Film 12µ PI/12µ ADH. to 75µ PI/75µ ADH. Additional Photoimagible
Photocoverlay 25µ, 37µ, 50µ, 62µ 25µ, 37µ, 50µ, 62µ
Stiffeners G10/FR4, Polyimide, BT G10/FR4, Polyimide, BT
EMI Shields Contact 3M for further information Contact 3M for further information
Heat Transfer Solutions Contact 3M for further information Contact 3M for further information

Dielecteric Patterning

CO2 Laser and Plasma Etching Yes Yes
Chemical Yes Yes

Sputtering

Materials Polyimide Polyimide
Metals Various metals and metal oxides Various metals and metal oxides

Plating

Electroless Copper >32µ Via >20µ Via
Electrolytic Nickel To Desired Thickness To Desired Thickness
Electrolytic Copper To Desired Thickness To Desired Thickness
Electrolytic Tin/Lead To Desired Thickness To Desired Thickness
Electrolytic Soft Gold To Desired Thickness To Desired Thickness
Immersion Gold .06µ .06µ
Immersion Tin Yes Yes
OSP Yes Yes
ENIG Yes Yes
ENEG Yes No
Selective Plating No Yes

Panel Size

Panel Size 304mm x 457mm 304mm x 457mm

Assembly

HASL Yes Yes
No Lead (RoHS) HASL Yes Yes
Connectors Yes Yes
Thermistors Yes Yes
Passive Components Yes Yes
Surface Encapsulation/Potting Yes Yes
RoHS* - Components Available Yes Yes
Stiffener/Reinforcement/Adhesive Yes Yes

Quality

Visual Inspection Yes Yes
Auto Optical Inspection Yes Yes
Scanning Electron Microscope Yes Yes
Electrical Test Yes Yes
Cross-Section Yes Yes
X-ray Fluoresence Yes Yes
Optical Measurement System Yes Yes
Profilometer Yes Yes
Impedence Matching Yes Yes
Ionic Contamination Yes Yes

*"RoHS Compliant 2002/95/EC" means that the product or part ("Product") does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/EC, unless the substance is in an application that is exempt under EU RoHS. This information represents 3M's knowledge and belief, which may be based in whole or in part on information provided by third party suppliers to 3M.

In the event any product is proven not to conform with 3M's Regulatory Information Appendix, then 3M's entire liability and Buyer's exclusive remedy will be in accordance with the Warranty stated below.

Click here for the most up to date capacity table (PDF 201 Kb).

Description Standard Advanced

** - Depends on the design constraints, please contact 3M for more information.

Imaging(microns)

1-Metal Layer

8µm Cu min. (trace/space) 17.5µ/17.5µ 15µ/15µ*
12µm Cu min. (trace/space) 17.5µ/17.5µ 17.5µ/17.5µ*
18µm Cu min. (trace/space) 25µ/25µ 25µ/25µ*
35µm Cu min. (trace/space) 50µ/50µ 50µ/50µ*

2-Metal Layer

5µm Cu min. (trace/space) 60µ/60µ 30µ/30µ*
12µm Cu min. (trace/space) 60µ/60µ 30µ/30µ*
18µm Cu min. (trace/space) 75µ/75µ 60µ/60µ*
35µm Cu min. (trace/space) 75µ/75µ 60µ/60µ*
Min. Via Diameter 35µ 150µ*
Min. Pad Diameter 240µ +100um*
Layer-to-Layer Registration 120µ 75µ*
Smallest feature 60µ 30µ*
Dryfilm Coverlay 25µ,38µ 25µ,38µ*
Cantilever/Flying Lead Width 75µ* 75µ*

Singulation

Registration +/- 100µ +/- 100µ
Precison Punch Contact 3M Contact 3M
Positional Tolerance Contact 3M Contact 3M
Feature Contact 3M Contact 3M
Positional Tolerance Contact 3M Contact 3M

Microvias

Size 35µ 35µ
Position Accuracy +/-100µ +/-100µ
Layers 2 2

Materials

Plated Copper 5µ - 35µ 3µ - 35µ
Polyimide 25µ - 50µ <25µ -50µ
Adhesives Acrylic, PSA Acrylic, PSA
Coverlay Film 12µ/25µ to 50µ/50µ 12µ/25µ to 50µ/50µ
Soldermask 3µ - 30µ 3µ - 30µ
Photocoverlay 25µ, 38µ 25µ, 38µ
Stiffeners FR4, Polymide, BT FR4, Polymide, BT, Al
EMI Shields Contact 3M Contact 3M
Heat Transfer Solutions Contact 3M Contact 3M

Dielecteric Patterning

CO2 Laser and Plasma Etching Contact 3M Contact 3M
Chemical Yes Yes

Sputtering

Materials Polyimide Polyimide
Metals Various metals and metal oxides Various metals and metal oxides

Plating

Electroless Copper Contact 3M Contact 3M
Electrolytic Nickel 0.5µ - 2.8µ 0.5µ - 2.8µ
Electrolytic Copper 3µ - 35µ 3µ - 35µ
Electrolytic Tin/Lead Contact 3M Contact 3M
Electrolytic Soft Gold 0.1µ - 0.3µ 0.1µ - 0.3µ
Immersion Gold Contact 3M Contact 3M
Immersion Tin Contact 3M Contact 3M
OSP Contact 3M Contact 3M
Selective Plating Yes(Ni & Au) Yes(Ni & Au)

Roll-to-Roll-Processing

Roll-to-Roll Yes Yes
Web width 304mm 304mm

Assembly

HASL Yes Yes
No Lead (RoHS) HASL Yes Yes
Connectors Yes Yes
Thermistors Yes Yes
Passive Components Yes Yes
Surface Encapsulation/Potting Yes Yes
RoHS* - Components Available Yes Yes
Stiffener/Reinforcement/Adhesive Yes Yes

Quality

Visual Inspection Yes Yes
Auto Optical Inspection Yes Yes
Scanning Electron Microscope Yes Yes
Electrical Test Yes Yes
Cross-Section Yes Yes
X-ray Fluoresence Yes Yes
Optical Measurement System Yes Yes
Profilometer Yes Yes
Impedence Matching Yes Yes
Ionic Contamination Yes Yes

*"RoHS Compliant 2002/95/EC" means that the product or part ("Product") does not contain any of the substances in excess of the maximum concentration values in EU Directive 2002/95/EC, as amended by Commission Decision 2005/618/EC, unless the substance is in an application that is exempt under EU RoHS. This information represents 3M's knowledge and belief, which may be based in whole or in part on information provided by third party suppliers to 3M.

In the event any product is proven not to conform with 3M's Regulatory Information Appendix, then 3M's entire liability and Buyer's exclusive remedy will be in accordance with the Warranty stated below.

  • Design Services
    • 3M offers design services; we can help take a product from concept to development to final mass production of flexible printed circuits.
  • Assembly
    • Stiffeners
    • Cover-lays
    • EMI and Chemical Shields
    • SMS Assembly
  • Substrates
    • Adhesiveless polyimides
    • High Quality
    • Ultra-clean metalized substrates, manufactured by 3M Flexible Circuit Foundry or purchased from a selection of outside suppliers.