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Specialty Applications

3M supplies custom 1- and 2-metal layer flexible circuits for fine pitch and/or high-density applications. With bench-to-bench engagement, we will apply our advanced engineering services to help optimize your application, from initial design through volume production


Medical Devices & Diagnostics

For more than 20 years, 3M Flexible Circuit Foundry business has designed and manufactured a variety of flexible circuits, partnering with the leading experts in the medical imaging industry. Known as a materials science company, 3M has access to an ever widening portfolio of innovative solutions in creating next-generation circuit designs. Our solutions enable new approaches to your engineering challenges.

3M enables our customers to achieve increased routing density by offering unique interconnect solutions that use ultra thin flexible circuit materials in combination with state-of-the-art circuit processing techniques. This efficient routing density allows medical imaging companies to design ultrasound transducers and digital X-ray sensors with greater sensitivity, providing more elements per unit area to accommodate the demand for higher resolution, real time imaging devices capable of resolving minute anomalies in the human body.

3M's experience enables its engineers to clearly understand the detailed technical requirements for applications - from ultrasound transducer probes to digital x-ray detector panels - helping customers to confidently and rapidly move from conceptualization to market. In addition, 3M's global presence enables our customers to receive support for their development process and needs no matter where they are located.


Medical Devices & Diagnostics

3M Flexible Circuit Foundry business has created an efficient, high-volume, roll-to roll manufacturing process along with material sets that fit the performance requirements for flexible circuits in inkjet printer applications. Our expertise in materials enables solder mask and cover-lay solutions for long-life corrosion protection in harsh ink environments. Our fine-pitch circuitization allows for device size reduction, while our polyimide etching allows backside access to pads and cantilevered leads to support Tape Automated Bonding (TAB) techniques. 3M's engineers are here to assist you in your most demanding applications, while welcoming new challenges.