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As consumer demand for faster, more efficient electronics rises, so too do the requirements of the semiconductor and chemical processing industries. From high purity applications to highly corrosive environments, these industries require innovative solutions to fabricate advanced products quickly and consistently. That’s why 3M offers a wide variety of chemical-resistant Dyneon™ Fluoropolymers as well as high purity boron isotope materials optimized to meet the demanding requirements of these critical applications. Advanced materials deliver high performance where other materials fail—helping to improve productivity and protect product integrity.

Chemical-resistant Materials for Semiconductor Manufacturing

High Purity Boron Materials for the Semiconductor Market

High Purity Boron Materials for the Semiconductor Market

Advanced technologies for fabricating silicon wafers doped with boron, the only suitable p-dopant, require innovative solutions to meet stringent technical requirements. 3M™ Stable Isotopes not only deliver high purity—up to 99.9999% for the silicon wafer industry—and consistent quality, but also boast customizable enrichment levels and a wide range of particle size distributions and characteristics. Many of these products exceed accepted standards for the semiconductor industry worldwide, enabling the semiconductor industry to continue researching and developing technological advancements.

Learn more about 3M™ Stable Isotopes for the semiconductor market

3M™ Dyneon™ Perfluoroelastomers for extreme chemical environments

3M™ Dyneon™ Perfluoroelastomers for extreme chemical environments

In semiconductor wafer fabrication and other highly aggressive chemical applications, 3M™ Dyneon™ Perfluoroelastomers (PFEs) deliver outstanding performance where no other class of elastomer can measure up. 3M offers a wide variety of PFE materials (FFKM), including optically clear, high temperature and peroxide cure formulations engineered for both wet process and dry side semiconductor applications. All 3M PFEs have fully fluorinated backbone structures for broad chemical and thermal stability, and feature low metal ion content, low extractables and low outgassing. 3M™ Dyneon™ PFE 300Z, for example, is an advanced polymer and catalyst system for producing optically clear, ultra-high purity seals and gaskets. Phosphorus-free and silica-free, PFE 300Z offers low particle generation and is ideal for plasma applications. By reducing the potential for costly contamination, 3M perfluoroelastomers help semiconductor manufacturers achieve higher wafer yields with fewer chip defects.

Learn more about 3M™ Dyneon™ Perfluroelastomers

High purity 3M™ Dyneon™ Fluorothermoplastics for semiconductor manufacturing

High purity 3M™ Dyneon™ Fluorothermoplastics for semiconductor manufacturing

Semiconductor manufacturers simply cannot afford contamination. Impurities appearing anywhere in the work environment can result in lower chip yields and higher costs. Ultra High Purity (UHP) grades of 3M™ Dyneon™ Fluorothermoplastics offer low metal and ion extractables to reduce contaminants throughout the manufacturing process. In addition, a controlled packaging environment helps ensure that all 3M UHP thermoplastics maintain their ultra-pure state as manufactured. These advanced materials feature excellent temperature and chemical resistance, very low permeation and extremely smooth surfaces. High purity 3M thermoplastics are ideal for wafer carriers, etch basins, fluid handling systems and fire-retardant sheets for clean-room windows and doors.

Learn more about high purity 3M™ Dyneon™ Fluorothermoplastics

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