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3M™ Wafer De-Taping Tape 879

3M ID  AM000003906     
3M(TM) Wafer De-Taping Tape 3305 and 879
3M(TM) Wafer De-Taping Tape 3305 and 879
3M(TM) Wafer De-Taping Tape 3305 and 879
3M(TM) Wafer De-Taping Tape 3305 and 879
3M™ Wafer De-Taping Tape 879 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
Features and Benefits
  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power
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    Overview

    Product Attributes

    Adhesion to SS15.2 N/cm
    Adhesive TypeRubber
    ApplicationWafer De-Taping
    BackingPolyester Film
    Elongation at Break120%
    Product Series879
    Tape Thickness4.33 mils
    Tape Thickness (metric)0.110 mm
    Tensile Strength at Break66.7 N/cm

    Product Disclaimer

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