3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
Features and Benefits
Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
Specially designed for the removal of adhesives after separating support glass in 3M™ Wafer Support System.
3M products shown on this website may not be available in all geographic regions or may not be available at this time. 3M™ Wafer Support System(WSS) adhesives are limited to use on 3M WSS authorized equipment. Please contact your local sales representative to determine product availability.