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3M™ Wafer De-Taping Tape 3305

3M ID  AM000003898     
3M(TM) Wafer De-Taping Tape 3305 and 879
3M(TM) Wafer De-Taping Tape 3305 and 879
3M(TM) Wafer De-Taping Tape 3305 and 879
3M(TM) Wafer De-Taping Tape 3305 and 879
3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.
Features and Benefits
  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power
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    Overview

    Product Attributes

     Adhesion to Ethyl Vinyl Acetate‎ 56 oz./in. width (61 N/100 mm)‎
     Adhesion to SS‎ 120 oz./in. width (131 N/100 mm)‎
     Adhesive Type‎ Rubber‎
     Application‎ Wafer De-Taping‎
     Backing‎ Polyester Film‎
     Elongation at Break‎ 177%‎
     Product Series‎ 3305‎
     Tape Thickness‎ 2.7 mils‎
     Tape Thickness (metric)‎ 0.069 mm‎
     Tensile Strength at Break‎ 78.4 N/cm‎

    Product Disclaimer

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