3M™ Thermally Conductive Silicone Interface Pad 5595
3M™ Thermally Conductive Silicone Interface Pad 5595 is a soft, silicone elastomer with thermal conductivity of 1.6 W/m-K. Conformable at low pressure to minimize stress on components and fill gaps. Good dielectric properties.
Features and Benefits
Good thermal stability of the base polymer with excellent softness of the thermal pad.
Good thermal conductivity in a soft silicone polymer base.
The product tack is such that a mechanical means to support the pad in a final assembly is required.
Gap filling parts in electronic components
IC Packaging Heat Conduction
Heat Sink Bonding
Chip Heat Conduction
LED Board TIM
HD TV Address IC Chip and Scan Module Board
Application Battery Thermal Management, LED Lighting Thermal Management, Thermal Gap Pad, Thermal Interface-Damping-Cushioning
Application Category Thermal Interface Materials
Base Material Filled Silicone Polymer
Carrier Type No Carrier
Dielectric Strength 15.7 kV/mm
Easy Release Top Liner Type PET Film
Flammability Rating UL 94 V-0
Hardness Shore 00 = 50 to 60
Liner Type Double
Product Series 5595
Thermal Conductivity 1.6 W/m-K
Thermal Impedance 0.64 Degree C-in^2/W (20.0 mil), 1.15 Degree C-in^2/W (40.0 mil), 1.66 Degree C-in^2/W (60.0 mil), 2
Thermal Impedance (metric) 4.5 Degree C-cm^22/W (0.50 mm), 7.8 Degree C-cm^2/W (1.0 mm), 11.0 Degree C-cm^2/W (1.5 mm), 14.3 D
Tight Side Release Liner Type PET Film
Total Tape Thickness without Liner 20.0 mil, 40.0 mil, 60.0 mil, 80.0 mil
Total Tape Thickness without Liner (metric) 0.50 mm, 1.0 mm, 1.5 mm, 2.0 mm
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