FOG (Flex on Glass) and FOB (Flex on Board) Bonding Process
TAB (Tape Automated Bonding) and OLB (Outer Lead Bonding) Bonding Process
COB (Chip on Board) and COF (Chip on Flex) Bonding Process
Thermally conductive insulators for semiconductor element, esp. thermal conductive spacer of power transistor (TV, stereo, transceiver, computer, copy machine and facsimile etc.)
Replace ceramic insulators such as BeO, BN and Alumina
Thermal conductive media of heat generating, cooling and temperature sensor including heater, temperature fuse etc.
This material is specifically used for the assembly of electrical connection by ACF (anisotropic conductive film) on TFT-LCD (Thin Film Transistor - Liquid Crystal Display) module, touch screen module, camera module and other flexible circuit board bonding on electronic parts. These products can be used as the special functional sheet during the ACF bonding process to improve heat and pressure distribution of Thermode (heating tool) on application area and prevent any damage on electrical connection and bonding part during electrical connection/assembly process. Through its high thermal conductivity and superior softness originated from silicone layer, it promotes fast and uniform heat transfer and pressure distribution with no damage on PCB and flex circuit part.
Battery Thermal Management, LED Lighting Thermal Management, Thermal Gap Pad, Thermal Interface-Damping-Cushioning