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3M™ Thermally Conductive Epoxy Adhesive TC-2810

3M ID  AM000002700     
3M(TM) Thermally Conductive Epoxy Adhesive TC-2810
3M(TM) Thermally Conductive Epoxy Adhesive TC-2810
3M(TM) Thermally Conductive Adhesives Group Image
3M(TM) Thermally Conductive Epoxy Adhesive TC-2810
3M(TM) Thermally Conductive Adhesives Group Image
3M(TM) Thermally Conductive Liquid Epoxy TC2707 Heat Sink
3M(TM) EPX Applicator and Nozzle
3M™ Thermally Conductive Epoxy Adhesive TC-2810 is a thermally conductive 2-part epoxy using boron nitride(BN) filler for good thermal conductivity with high adhesion.
Features and Benefits
  • High adhesive strength
  • Slight tack allows pre-assembly
  • Good surface wet out
  • Low viscosity for potting application
  • Good gap filling
  • Thin bonding line
  • Good thermal conductivity (1.0-1.4 W/m-K)
  • Low CL ion content and outgassing
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    Overview

    Product Attributes

    ApplicationBattery Thermal Management, Heatsink-Thermal Interface Attachment, Heatsink-Thermal Interface-Non Bonding, IC Packaging Heat Conduction, LED Lighting Thermal Management, Thermal Material Potting
    Application CategoryThermal Interface Materials
    ColorCream
    Dielectric Strength3.0 kV/mm
    Full Cure Schedule23 Degree C/24 hours, 50 Degree C/270 minutes, 70 Degree C/90 minutes, 90 Degree C/30 minutes, 120 D
    Glass Transition Temperature (Tg)60 Degree C (when cured at RT for 24hrs)
    Operating Temperature Range (Celsius) Long Term(Weeks-Months) 80 to 100 Degree C
    Operating Temperature Range (Celsius) Short Term(Hours-Days) 125 to 140 Degree C
    Product SeriesTC-2810
    Thermal Coefficient of Expansion62 ppm/Degree C (below Tg), 205 ppm/Degree C (above Tg)
    Thermal Conductivity0.8-1.4 W/m-K
    Thermal Impedance0.05 (Degree C)-in^2/W (with thickness 50um)
    Thermal Impedance (metric)0.32 (Degree C)-cm^2/W (with thickness 50um)
    ViscosityMixed 40,000 ~ 800,000 cps
    Worklife Time and Temperature60 minutes at 72 Degree F (23 Degree C)

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