3M™ Thermally Conductive Acrylic Pad 5574 is designated to provide a preferential heat transfer path between heat generating components like integrated circuit chip and heat spreaders as aluminum heat sink.
Features and Benefits
Good softness and conformability even to non-flat IC surfaces and heat spreading blocks.
No siloxane gas & Si oil bleeding which often causes electric connection failure can be generated
High pressure relaxation reduces pressure to electric components
Good thermal conductivity and good electrical insulation properties
Slight tack allows pre-assembly
Good wettability for better thermal conductivity
Mechanical fastening such as clamp, bracket, screw and additional tapes & adhesives bonding can be used in parallel with this pad