3M™ Thermally Conductive Acrylic Interface Pad 5571 is designated to provide a preferential heat transfer path between heat generating components like integrated circuit chip and heat spreaders as aluminum heat sink.
Features and Benefits
High thermal conductivity, 2.0 W/m-K on plane direction
Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
No siloxane gas/ oil bleeding which often causes electric connection failure can be generated
High pressure relaxation reduces pressure to electric components
Good electrical insulation properties
Slight tack allows easy pre-assembly
Good wetting performance for better thermal conductivity
Mechanical fastening such as clamp, bracket, screw and additional tapes and adhesives bonding can be used in parallel with this pad.