Bonding of dissimilar substrates (glass to metal or engineering plastic)
This hot melt film adhesive is a curable epoxy-based film that provides a structural against metal, glass and other substrates. It provides for excellent solvent, humidity resistance, is tack free and possesses low flow characteristics.
1.0 mil, 3.0 mil
Adhesive Thickness (metric)
0.03 mm, 0.80 mm
Bezel Bonding, Case Assembly, Low Surface Energy Bonding