3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
Features and Benefits
Heat or solvent activation
Can be die-cut
Slight surface tack
Heat crosslinkable option
Lower temperature lamination of the nitrile phenolic film range
This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.
Adhesive Thickness (metric)
Bezel Bonding, Case Assembly, Flex Bonding, Flex Stiffener Bonding, Glass Cloth Splicing for PCB, Low Surface Energy Bonding