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3M™ Thermal Bonding Film 583

3M ID  AM000000910     
3M™ Thermal Bonding Film 583
3M™ Thermal Bonding Film 583
3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.
Features and Benefits
  • Flexible
  • Heat or solvent activation
  • Can be die-cut
  • Slight surface tack
  • Heat crosslinkable option
  • Lower temperature lamination of the nitrile phenolic film range
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    Product Attributes

    Adhesive Thickness2.0 mil
    Adhesive Thickness (metric)0.05 mm
    Adhesive TypeThermoset
    ApplicationBezel Bonding, Case Assembly, Flex Bonding, Flex Stiffener Bonding, Glass Cloth Splicing for PCB, Low Surface Energy Bonding
    Application CategoryBonding
    Base MaterialNitrile Phenolic
    Bond Cure Time5 minutes
    Bondline Temp (Celsius)121 degree C
    Bondline Temp (Fahrenheit)250 degree F
    Bond TypePermanent
    Elongation800% (Before Crosslinking)
    Faceside Liner Thickness3.0 mil
    Faceside Liner Thickness (metric)0.08 mm
    Faceside Liner TypeSilicone Paper
    Film ColorBrown
    Maximum Width Available48 in
    Maximum Width Available (metric)1200 mm
    Product FormRoll
    Product Series583
    SubstrateAluminum, FR-4, Steel (Cold Rolled, Stainless)


    Data Sheet

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