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3M™ Scotch-Weld™ Structural Adhesive EW2060HF

3M ID  AM000001157     
3M(TM) Scotch-Weld(TM) Epoxy Adhesive EW2050
3M(TM) Scotch-Weld(TM) Epoxy Adhesive EW2050
3M™ Scotch-Weld™ Structural Adhesive EW2060HF is a one-part non-filler type adhesive
Features and Benefits
  • Low temperature curable (80 degree C)
  • Fast cure at high temperature (140 degree C, 10 min)
  • 115 degree C of glass transition temperature
  • Halogen compliant
  • Requires heat to cure
  • Does not require mixing
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    Overview

    Product Attributes

    Adhesive ColorBefore cure = light pink, After cure = light yellow
    Adhesive Type1 Part Epoxy
    ApplicationCamera Module Assembly, Memory Card Bonding
    Application CategoryBonding
    Bondline Temperature and Time140 degree C @ 10 minutes
    Elongation8%
    Full Cure Schedule30 minutes @ 100 Degree C
    Glass Transition Temperature (Tg)115 Degree C
    Hardness85 Shore D
    Peel Strength34 piw on Aluminum @ 180 Degree C
    Product SeriesEW2060HF
    Shear Strength5,800 psi on Aluminum
    SubstrateAlloy, Aluminum, Magnet, Metal, SUS
    Viscosity90,000 cps

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