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3M™ Polyimide Film Tape 5413 Amber

3M ID  AM000000068     
3M (TM) 5413 Amber Poly/Silicone
3M (TM) 5413 Amber Poly/Silicone
3M(TM) High Temperature Masking Tape 5563 on PC Board
3M™ Polyimide Film Tape 5413 with DuPont™ Kapton® polyimide film and silicone adhesive used for PCB solder masking and other high temperature applications. Amber, 2.7 mil thick..
Features and Benefits
  • The DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
  • Is dimensionally stable at high temperatures, which prevents rework, enabling high productivity
  • Is flame retardant, chemical and radiation resistant which protects surfaces to help reduce replacement costs
  • The silicone adhesive's high temperature performance reduces adhesive transfer which helps to eliminate cleaning, enabling high productivity
  • Polyethylene tape core instead of cardboard
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    Product Attributes

    Adhesion to Stainless20 oz/in
    Adhesion to Stainless (metric)0.6 kg/25.4mm, 2.2 N/cm
    Adhesive TypeSilicone
    ApplicationSolder Masking Tape
    Application CategoryProtection
    Performance FeaturesChemical Resistant, Flame Retardant (UL510FR), Halogen Free, No Adhesive Residue, Radiation Resistant
    Primary LinerNone
    Product FormRoll
    Product Series5413
    Standard Roll Size36 yd
    Standard Roll Size (metric)33 m
    Temperature Range (Celsius)- 73 Degree C to 260 Degree C
    Temperature Range (Fahrenheit)- 100 Degree F to 500 Degree F
    Tensile Strength at Break33 lbs/in
    Tensile Strength at Break (metric)578 N/100 mm
    Total Tape Thickness without Liner2.7 mil
    Total Tape Thickness without Liner (metric)0.07 mm
    Total Thickness2.7 mil
    Total Thickness (metric)0.07 mm


    Data Sheet

    Product Disclaimer

  • DuPont™ and Kapton® are trademarks of E. I. du Pont de Nemours and Company or its affiliates.
  • The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes.
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