3M™ Epoxy and Copper Foil Laminate CU-10S is a 7.2 mil laminate of 1.4 mil softened copper foil to 3.6 mil flame-retardant epoxy film that is bonded with 1.6 mil adhesive. There is NO adhesive on the laminate for bonding to an application substrate.
Features and Benefits
Dead soft 1-ounce (1.4-mil) copper foil backing for excellent shielding effectiveness with good solderability.
Epoxy film laminate with high dielectric strength that is UL94 V-0 flammability rating for dependably insulating shield from neighboring circuits.
RFI/EMI (radio frequency interference/ electromagnetic interference) shielding with insulation between printed circuit boards
Conductive circuit or bus bar for low voltage applications
Used for applications where adhesive is not required to attach to substrate and provide ESD (electrostatic discharge) grounding through the adhesive.
ESD grounding requires separate connection to backing
The CU-10S laminate has an epoxy film to insulate copper foil from neighboring circuits with a breakdown strength of 6 kV. This laminate is UL recognized with V-0 rating for flame retardancy per UL 94. It is designed for a variety of applications: point-to-point electrical contact, EMI/RFI shielding. This laminate can used in both electronic & electrical devices, shielded rooms and EMI test laboratories for prototyping, design and troubleshooting. The CU-10S laminate is available from 3M in log rolls (standard size of 19.7 inch x 21.8 yds or 500 mm x 20,0 m) to 3M slitter/converters. Also, 3M offers to 3M authorized distributors (and slitter/converters) various size slit rolls for resale to end users. Custom die-cut and formed parts are available from 3M slitter/converters.