3M™ Epoxy Bonding Adhesive EG-2P-3005
3M™ Epoxy Bonding Adhesive EG-2P-3005 is a fast setting, flexible 1:1 mix ratio epoxy adhesive/sealant. Its flexibility when cured makes it ideal for applications involving dissimilar surfaces where thermal coefficient of expansion may be a problem.
Features and Benefits
Fast setting, flexible epoxy adhesive
Bonding dissimilar substrates
Adhesive Color Clear Base, Clear Accelerator
Adhesive Type 2 Part Epoxy
Application Battery Bonding, Battery Door Attachment, Bezel Bonding, Case Assembly, Cover Lens Bonding, Display Bonding, Flex Stiffener Bonding, Logo Bonding, Low Surface Energy Bonding, Potting, Ruggedizing, Speaker Module Assembly, Touch Panel Bonding
Application Category Bonding, Potting & Rigidizing
Full Cure Schedule 48 hrs @ 23 Degree C
Glass Transition Temperature (Tg) 12 Degree C
Handling Strength Time and Temperature 15 -20 minutes @ 23 Degree C/50 psi overlap shear strength
Hardness 60 Shore D
Mix Ratio Volume Base:Accelerator 1:1
Peel Strength 35 piw on Aluminum @ 180 Degree C
Product Series EG-2P-3005
Shear Strength 2,500 psi on Aluminum
Substrate Aluminum, FR4, Plastics (Polyamide, Polycarbonate, PC/ABS), Stainless Steel
Viscosity Accelerator 8,000 cps to 18,000 cps @ 25 degree C, Base 1,000 cps to 6,000 cps @ 25 degree C
Worklife Time and Temperature 3 to 5 minutes @ 23 Degree C
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