3M™ eCAP 7805 is a double sided, self-stick EMI gasket pad or tape which provides good electrical conductivity for EMI shielding/ESD grounding. The pad achieves a unique filler distribution in three dimensional structure throughout the adhesive matrix.
Features and Benefits
A thicker conductive tape
Isotropic XYZ-axis electrical connectivity
Bridges wider gaps
Unique particle design allows better resistance in a thicker product
Works well on softer surfaces such as gold to gold
Higher contact resistance on harder surfaces such as stainless steel
Electrical bonding and ESD grounding of electronic and electrical devices
Electrically connects and mechanically bond EMI/RFI shield and gasket to metal frames and enclosures
The PSA matrix is filled with silver coated fillers which allow interconnection between substrates through the adhesive thickness (the “Z-axis”) and also provides electrically conducting in the plane of the adhesive ("X-Y Axis").
Antenna Bonding (with Grounding), EMI Shielding (with Grounding), Flex Bonding (with Grounding), Flex Stiffener Bonding (with Grounding), Grounding, Metal to Metal Bonding (with Grounding), Static Dissipation