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3M™ Diamond Pad Conditioner A168, 4.25 in diam

3M ID  XA004100500     
3M(TM) Diamond Pad Conditioner A168, 4.25 in diam
3M(TM) Diamond Pad Conditioner A168, 4.25 in diam
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for superior diamond retention, with controlled diamond placement and protrusion.
Features and Benefits
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for superior retention
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    Overview

    Product Attributes

    Abrasive MaterialNickel based alloy with patterned diamond
    Abrasive Working SurfaceFull Face
    Aggressiveness15-19
    ApplicationCMP
    Carrier ColorBlack
    Carrier FormatDisk - with bevel edge
    Carrier Size4.25 inch diameter
    Carrier SubstratePolycarbonate
    CMP ProcessCu (bulk), PMD/ILD, STI Process, W (bulk)
    Diamond Size251 um
    Diamond TypeType 4, semi-sharp
    Manufacturing LocationSingapore
    Product SeriesA168
    Product TypeDiamond Pad Conditioner

    Product Disclaimer

  • Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations.
  • The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes.
  • 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.