3M™ Scotch-Weld™ Low Density Void Filling Compounds
Save time and costs with these lightweight, extrudable and pumpable potting compounds for aircraft interiors.
3M™ Scotch-Weld™ Structural Void Filling Compounds are advanced technology epoxy adhesive materials developed to help cut production time and costs, reduce part weight and comply with safety regulations governing aircraft interiors. They are flame-resistant and compliant with the anticipated new FAA flammability requirements.
These compounds have a combination of features that allow for fast, direct application to the honeycomb core panel for edge-filling, void filling and reinforcement. Scotch-Weld Low Density Void Fillers are fast-cure, non-brittle and non-sag for easier handling, and will resist chip-outs and breakouts.
See how Scotch-Weld Low Density Void Fillers can speed up your process for edge-fill, void fill and honeycomb reinforcement.
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This information will be used solely by the 3M Aerospace department to communicate via your request on these products, it will not be shared outside 3M Aerospace.
