3M™ Scotch-Weld™ Low Density Void Filling Compounds
Save time and costs with these lightweight, extrudable and pumpable potting compounds for aircraft interiors.
3M™ Scotch-Weld™ Structural Void Filling Compounds EC-3550 B/A FST and EC-3555 B/A FST are advanced technology epoxy adhesive materials developed to help cut production time and costs, reduce part weight and comply with safety regulations governing aircraft interiors.
These compounds have a combination of features that allow for fast, direct application to the honeycomb core panel for edge-filling, void filling and reinforcement. Scotch-Weld Low Density Void Fillers are fast-cure, non-brittle and non-sag for easier handling and will resist chip-outs and breakouts.