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3M™ Scotch-Weld™ 250 Degree F Cure Epoxy Films

The high peel strength epoxy technology pioneered by 3M for low temperature/low pressure curing adhesive films is now standard throughout the industry for bonding skins to honeycombs.
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3M™ Scotch-Weld™ Structural Adhesive Film AF 126 FR
Flame retardant, thermosetting, toughened, epoxy adhesive film designed for structural bonding. Cure at temperatures as low as 180F (82C). Excellent strength for honeycomb sandwich applications. High degree of tack in the uncured state. Self extinguishing.
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 126-2
Designed for structural bonding of metals. Cure at temperatures as low as 180°F (82°C). Excellent strength in metal-to-metal, composite, and honeycomb sandwich applications. Low flow during cure. Low tack for easy handling.
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 126-3
Excellent strength in metal-to-metal, composite, and honeycomb sandwich applications. Cure at temperatures as low as 180°F (82°C). Low flow during cure. Low tack for easy handling.
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 126-4
Designed for structural bonding of metals. Cure at temperatures as low as 225°F (107°C). Optimum results obtained with a cure of 250°F (121°C) for one hour. Excellent strength in metal-to-metal and honeycomb sandwich applications over a temperature range of -67°F to 250°F (-55°C to 121°C).
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 126
Designed for structural bonding of metals. Cure at temperatures as low as 225°F (107°C). Optimum results obtained with a cure of 250°F (121°C) for one hour. Excellent strength in metal-to-metal and honeycomb sandwich applications over a temperature range of -67°F to 250°F (-55°C to 121°C).
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2
Designed for both solid panel and honeycomb sandwich constructions. High bond strength from -67F to 250F. High fracture toughness and peel strength. Excellent resistance to high moisture environments before and after curing. Short cure time at 225F (90 minutes). Capable of low pressure bonding.
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 500
High bond strength from -67 to 300F (-55 to 149C). Minimum 45 days out-time at ambient temperatures. Controlled flow. Excellent composite bonding. Maintains good metal bonding performance. Composite co-cure adhesive with excellent peel.
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 563
Designed for bonding skins to honeycomb. High bond strengths from -67 to 300F (-55 to 149C). Excellent durability in hot and wet environments and designed for applications where hot and wet service is required.
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 3109-2
Excellent performance in honeycomb and metal-to-metal sandwich applications in a -67 to 300F (-55 to 149C) temperature reange. Cure temperatures as low as 225F (107C) and up to 350F (177C). Improved reisitance to high moisture pre-cure conditions. Unsupported version can be reticulated on honeycomb.
 
 
3M™ Scotch-Weld™ Structural Adhesive Film AF 3185
Non-volatile, thermosetting epoxy laminating adhesive and glass cloth combination. Designed for structural bonding and for the preparation of reinforced epoxy glass laminate. Cure temperatures as low as 200°F (93°C) may be used. Easy to cut. Repositionable. Excellent for vacuum or low pressure curing.