3M™ Scotch-Weld™ Structural Core Splice Adhesive Film AF 3002 250-350F (121-177C) curing, low-density, expandable product designed for the purpose of filling mismatched areas and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C) temperature range when cured at 250F. High performance over a -67F to 350F (-55C to 177C) temperature range when cured at 350F (177C).
3M™ Scotch-Weld™ Structural Core Splice Adhesive Film AF 3024 250F (121C) to 350F (176C) curing, low-density, expandable core splice adhesive film. High expansion (250%). Low sag during cure. Low volatile loss. High performance from -67°F to 350°F (-55°C to 176°C).
3M™ Scotch-Weld™ Structural Core Splice Adhesive Film AF 3028 250F to 350F (121C to 176C) curing, low-density, expandable core splice adhesive film. Expands during cure for void filling and core splicing. Low sag during cure. Low volatile loss during cure. High performance from -67F to 350F (-55C to 176C).
3M™ Scotch-Weld™ Structural Core Splice Adhesive Film AF 3070 FST Designed for interior edge finishing and core splicing of sandwich panels. Full stand lone FST properties, meets FAR 25.853 or ABD 0031. Dual curing system (250 F to 350 F). Low expansion. Low density. Halogen-free FST system.
