Non curing, ultra-high performance thermal interface grease for transferring heat
from a heat source (e.g. processor chip) to a heat sink. The blend of inorganic
fillers contained in an organic matrix ensures high thermal conductivity and low thermal resistance.
Low viscosity grease, designed for use in screen printing applications. Screen printing of this material results in a thin bond line and consequently higher thermal performance.
A lower viscosity than 3M TCG-2037 which allows for a thinner bond line leading to improved thermal resistance and designed for use in screen printing applications.
An ultra-high performance thermal interface material for transferring thermal energy from a heat source (e.g.: processor chip, graphics chip, etc.) to a heat sinking or heat spreading surface.
A high performance thermal interface material for transferring thermal energy from a heat source (e.g.: processor chip, graphics chip, etc.) to a heat sinking or heat spreading surface.