Today's sophisticated electronics manufacturing and assembly applications require reliable bonds and seals. 3M™ Liquid Epoxy Adhesives, including 3M™ Scotch-Weld™ Epoxies and 3M™ Jet-melt™ Adhesives, deliver the performance and cost efficiencies you need for a broad spectrum of applications.
Electronic Grade (EG) Epoxies
Produce far lower contamination levels of ionic and outgassing impurities than typical epoxy adhesives
Excellent alternative to mechanical fasteners and lower-grade adhesives
Ideal for fabrication and assembly of critical components
One-Part Epoxies
One-part 3M™ Scotch-Weld™ Epoxies provide superior structural adhesive performance
Gain durability, environmental resistance and chemical resistance
Eliminate mixing, weighing and work life limitations
Cure on demand when heat is applied, gaining flexibility in processing
Superior structural adhesive performance where durability, environmental resistance and chemical resistance are necessary. Cures on demand when heat is applied offering flexibility in processing.
Versatile line of high performance formulations. Reach bonding strength in seconds. Line includes low-melt formulations for many heat-sensitive substrates.
Use 3M™ Liquid Epoxies for fabrication and assembly of critical components, from hard disk drive and printed circuit board fabrication to cellular phone and computer assembly
Select one-part epoxies for applications where it's desirable to reduce processing steps while maintaining structural superiority
Select two-part epoxies for applications where outgassing and corrosion of material bonds are concerns and structural integrity is a priority
Select hot melt adhesives for applications requiring strong, elastic, cost-efficient bonding, sealing, potting and encapsulating
