3M™ Adhesive for Temporary Bonding

3M's Wafer Support System combines 3M materials and authorized WSS equipment to support temporary wafer bonding and ultra-thin wafer processing for 3D TSV processes and 3D packaging applications.

The 3M™ Wafer Support System combines proprietary 3M temporary bonding technologies with world class equipment designed specifically to process wafers using 3M's wafer support system materials – creating a complete, cost-effective solution for high-volume manufacturing of ultra-thin wafers for 3D TSV and related applications.

Products

Product Documentation

Application Tips

Product	Applications/Notes
3M™ UV-Curable Adhesive LC-3200	3M™ Liquid UV-Curable Adhesive LC-3200 is a 100% solids UV curable acrylic adhesive. Adhesive LC-3200 is suitable for mounting silicon wafers and other substrates to support glass carriers using the 3M™ Wafer Support System.
3M™ Liquid UV-Curable Adhesive LC-4200	3M™ Liquid UV-Curable Adhesive LC-4200 is a 100% solids UV curable acrylic adhesive. Adhesive LC-4200 is suitable for mounting silicon wafers and other substrates to support glass carriers using the 3M™ Wafer Support System. Adhesive LC-4200 has been designed to allow for post processing of mounted wafers at temperatures up to 180°C for extended periods as well as short excursions to 200°C.
3M™ Light-To-Heat-Conversion (LTHC) Coating	3M™ Light-To-Heat-Conversion (LTHC) Release Coating is a solvent-based coating. This coating forms the light to heat conversion layer on glass using the substrate for 3M™ Wafer Support System by spin coating method.
3M™ Wafer De-Taping Tape 3305	3M™ Wafer De-Taping Tape 3305 is a transparent polyester film tape with an aggressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.