3M™ Electrically Conductive Adhesive Transfer Tapes
Help save time in a variety of specialized electronics assembly operations with 3M™ Electrically Conductive Adhesive Transfer Tapes. These long-lasting tapes can eliminate the need for screws and mechanical fasteners – while providing for contact grounding and EMI Shielding in the bond line gap/slit.
Advanced adhesive and conductive properties in an easy-to-use, pressure-sensitive tape
Hand- or machine-apply and die-cut to virtually any shape
Unique construction and adhesion ensures powerful, sustained contact
No messy residues, unlike carbon-loaded, semi-liquid adhesives
Excellent handling characteristics from built-in conductive fibers
Low electrical resistance/good conductivity for increased shielding effectiveness
3M™ Electrically Conductive Adhesive Transfer Tapes (ECATT) XYZ-Axis (Isotropic) Conductivity
3M offers a variety of high-quality isotropic tapes for your most demanding electronics industry applications:
3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9712, 9709S, 9707 are part of a highly filled ECATT product line that provides for excellent grounding and also EMI Shielding in the bond line gap/slit.
3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9713, 9723, 9725 are part of a conductive non-woven family ECATT product line that provides for excellent grounding performance, ease of rework and a variety of adhesive types. The 3M ECATT 9719 is a Silicone based ECATT for low surface energy surfaces, such as silicone EMI Gasket attachment.
3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719 and 7772 is part of a double-coated foil tape ECATT product line. The products offer good grounding and along with the 9712 non-woven ECATT product, offer a mid-range grounding performance product.
3M™ Electrically Conductive Adhesive Transfer Tape Z-Axis (Anisotropic) Conductivity
This easy-to-use, pressure-sensitive tape was designed for connecting, bonding, and grounding flex circuits, PCBs and EMI/RFI shields and gaskets. Apply at room temperature – no thermal bonding required.
3M ECATT General Overview Comparative Reference Table
Contact Resistance (R ohms) between a copper foil test panel and a 2nd sheet of a copper foil test panel using the 3M ECATT
Contact Resistance (R ohms) between a gold flexible test strip and a gold pad PCB panel using the 3M ECATT
Product
Pictorial Design
Thickness (µm)
Z or XYZ Conductivity (Based on 3M Test Method)
Conductive Filter Type
Adhesive Type
Features, Advantages, and Benefits
Copper foil bonded to a copper foil using the 3M ECATT / 3M 2-point resistance test method / 645mm2 Overlap Contact Area / 1 Hr RT Dwell. See note 1.
Gold flex bonded to PCB gold test pad. 6mm2 overlap contact area. 1 Hr RT Dwell. See note 1.
9703
50
Z
Silver
Low Outgassing Acrylic ECATT
Z-Axis, Low Outgassing
< 0.2
< 0.2
9704
50
Z
Silver
Low Outgassing Acrylic ECATT
Z-Axis, High adhesion, Low outgassing
< 0.2
< 0.2
9705
50
Z
Silver
Standard Acrylic ECATT
Z-Axis, Standard outgassing version of 9703
< 0.2
< 0.2
9706
50
Z
Silver
High Adhesion Acrylic ECATT
High Adhesion version of the 9705
< 0.2
< 0.3
9707
50
XYZ
Silver
High Adhesion Acrylic ECATT
High Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency, Low contact R to SS
< 0.2
< 0.3
9709
50
XYZ
Silver
Standard Acrylic ECATT
Standard Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency
< 0.2
< 0.3
9709S
50
XYZ
Silver
Standard Acrylic ECATT
Standard Adhesion, "Bond Line Gap/Slit" EMI Shielding for High Frequency, Low contact R to SS
< 0.2
< 0.2
9709SL
50
XYZ
Silver
Standard Acrylic ECATT
Premium low liner release version of 9709S
< 0.2
< 0.2
7805
150
XYZ
Silver
Standard Acrylic ECATT
Thicker ECATT for gap filling.
< 1.0
< 0.2
7850
150
XYZ
Carbon
High Adhesion Acrylic ECATT
Higher Thermal Conductivity & Thicker ECATT for gap filling.
< 1.0
< 10.0
7772
66
XYZ
Nickle & Alum DC
Medium Adhesion Acrylic D/C
Double Coated Aluminum foil
< 0.5
< 2.0
9712
125
XYZ
Carbon
Standard Acrylic ECATT
Non-woven conductive scrim & Standard acrylic adhesive.
< 1.5
< 15.0
9713
89
XYZ
Nickel/C
Standard Acrylic ECATT
Lower R non-woven conductive scrim vs. 9712 & Standard acrylic adhesive.
< 0.4
< 7.5
9719
100
XYZ
Nickel/C
Silicone ECATT
Low surface energy silicone adhesive, Higher temperature resistance, Lower R non-woven conductive scrim vs. 9712.
< 1.0
< 20.0
9720
35
XYZ
Nickel/Cu
High Adhesion Acrylic ECATT
Lower R non-woven conductive scrim vs. 9713, Thinner scrim design & Medium adhesion.
< 0.2
< 0.5
9723
60
XYZ
Nickel/Cu
High Adhesion Acrylic ECATT
Lower R non-woven conductive scrim vs. 9713, Thinner scrim design & High adhesion.
< 0.2
< 0.4
9725
50
XYZ
Nickel/Cu
Medium Adhesion Acrylic ECATT
Lower R non-woven conductive scrim vs. 9713 & High adhesion.
< 0.2
< 0.5
9732
100
XYZ
Nickel/Cu
Medium Adhesion Acrylic ECATT
Lower R non-woven conductive scrim vs. 9713, Thicker scrim design & High adhesion.
< 0.2
< 2.5
9760
50
XYZ
Nickel/Cu
High / Low Adhesion Double sided reworkable Acrylic ECATT
Easier rework as greater Face Side to Back Side adhesion delta. Easier rework version of 9725. High and Low adhesion sides.
< 0.2
< 0.8
9764
150
XYZ
Nickel/Cu
High / Low Adhesion Double sided reworkable Acrylic ECATT
Easier rework as greater Face Side to Back Side adhesion delta. Easier rework and thicker version of the 9732. High and Low adhesion sides.
< 0.5
< 5.0
9780
200
XYZ
Nickel/Cu
High / Low Adhesion Double sided reworkable Acrylic ECATT
Easier rework as greater Face Side to Back Side adhesion delta. Easier rework and thicker version of the 9732. High and Low adhesion sides.
< 0.5
< 5.0
Note 1: Test & performance results will vary based on items such as, but are not limited to: Contact area, Assembly method, Testing conditions, Normal variations
in product performance from one mfg. lot to a different mfg. lot of material-along with the normal variations found in a material within a mfg. lot (such as
thickness, available conductive material in an actual sample tested, variations in conductive filler materials and uniformity of conductive materials dispersed
within a lot of material, variations in adhesives, etc.), Test methods, Environmental aging, Exact test surface material type utilized, etc. The "Copper to Copper"
& "Gold Flex to PC" testing also should be noted for the differences related to the "Contact area" difference in the Test Methods (645 mm2 vs. 6 mm2)
as this does impact the test results. Testing of ECATT materials and the noted test substrates does not imply that the ECATT is suitable for an end use application
of similar materials. End user is responsible to determine if an ECATT and substrate combination is fit for use in their intended end use application.
Note 2: For applications that will ground to surfaces with an oxide layer, such as SS, the lead suggested products to test would include: 3M ECATT 9709S, 9707, 9723, 9725, 9719. For additional suggestions, please contact the 3M ECATT Technical Service.
