Surface Tension Reduction for Semiconductor Process Fluids
Advanced wetting agents for a wide range of process fluids and coatings
As semiconductor structures become smaller and more complex, there is a growing need to enhance the capabilities of fluids used in various process steps; for example, to improve penetration of etchants, coatings or strippers into very narrow trenches and other small features.
3M™ Novec™ Electronic Surfactants are low-metal surfactants, used as wetting agents to improve leveling and enhance flow-control in a variety of semiconductor manufacturing applications, including:
Buffered oxide etch (BOE) and metal etch solutions
Photoresists, photoresist strippers, and edge bead removers
Anti-reflective coatings for semiconductor lithography
Spin-on glass films
Novec electronic surfactants are very effective at low concentrations. In many cases only 100 ppm active Novec surfactant is required to reduce surface tension to less than 22 dynes/cm. Because of their ability to withstand continuous filtration, these advanced fluorochemical wetting agents can help extend the life of the etch bath, to achieve reduced costs and higher throughput.
Features and Benefits
Improved wetting in a variety of solutions
Excellent solubility, for easy mixing
Effective at low concentrations
Low metals content
Little or no effect on the etch rate
Surfactant is stable in the bath and is not removed during filtration operations.
Formulated using a sustainable chemistry, Novec electronic surfactants offer excellent solubility for easy mixing. They are also low in metals content.