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ESK Cooling Fillers for polymer solutions

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Dissipating heat within an extremely small space: 3M's BORONID® Cooling Fillers for polymer solutions

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Ongoing miniaturization and large-scale production of electronic components require materials that can quickly and effectively dissipate heat within an extremely small space. Highly thermally conductive polymers are used for applications involving the transfer, propagation or dissipation of heat.

ESK Boron Nitride Cooling Fillers for polymer solutions ensure highest possible heat spreading and heat transfer with simultaneous electrical insulation for injection molds and thermal interface materials for electric and electronic applications. System cost and weight reduction as well as enlarged design freedom, open up new opportunities of use for cooling polymers.

ESK Boron Nitride Cooling Filler portfolio of platelets flakes and agglomerates provide excellent process properties for an efficient and sustainable production.

 

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