Scotch-Weld™ 3450 FST: a pumpable, ultra low density void filler
Low density pumpable void filler helps aircraft interior manufacturers to save labour production time, reduces weight on all type of sandwich structures and meets increasingly stringent FST regulations.
3M has launched the first low density void filler that offers the combination of pumpability, ultra low density (typically 0.65 g/cc) and stand alone aircraft interior regulations fulfillment (flame retardancy, smoke density and toxic gas emission).
3M Scotch-Weld™ 3450 FST can be used to locally reinforce honeycomb sandwich panels. The heat curing low-density void filler can either be cured apart or co-cured with the surrounding materials (composite prepregs, core splice films, film adhesives etc…). As the cured filler is easily machinable, a cutting of a panel in a reinforced area enables an instant edge finish, which also then ensures compliance with FST requirements.
Lightweight and stiff, sandwich panels are a vital element of many modern aircraft interior designs, but filling such panels can be a costly and time consuming process. The process is even more difficult as stringent fire, smoke and toxic gas emission (FST) regulations needs to be fulfilled, which greatly limits the number of acceptable structural solutions. 3M Scotch-Weld™ 3450 FST is a one-part void filler containing halogen-free FST system that allows to meet FST requirements according to both the Airbus ABD 0031 directive and the FAR 25.853 / JAR 25.853 standard.
Against a background of increasing cost pressures, rising quality demands ever-tightening safety regulations and weight decrease, this product is going to solve a lot of pressing problems of aircraft interior manufacturers.
Typical applications for Scotch-Weld™ 3450 FST include floor panels, overhead stowage compartments, side and partition walls. As the void filler is co-cured with the surrounding materials in the sandwich panel layup, the void filler saves manufacture time and labor as it minimizes further manufacturing steps for the structure. The low density void filler also offers with the halogen-free FST system an improvement in operator health and safety aspects during the manufacturing process.
Scotch-Weld™ 3450 FST offers curing or co-curing temperatures from 120°C to 180°C.
Compatible with most common aerospace interior substrates including aluminium honeycomb, polycarbonate, glass/phenolic panels, polyetherimide and polyphenylsulfone, Scotch-Weld adhesive 7246-2 B/A FST is resistant to damage by water, salt spray, jet fuel and mineral oils.
To discuss any of these issues with a representative of the Aerospace group, please contact us
3M and Scotch-Weld are trademarks of 3M corporation.